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Will case bottom heat up more with better thermal paste?
- Thread starter nph
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I did notice that... especially with less thermal paste actually. If I put a gunk on it like they do in the manuals, I don't have a overheated bottom panel. If I put a thin slice like I'm suppose to, I get a bottom panel that can cook an egg... I have no idea why but thats what I observed
wouldn't this be what you had expected? optimal thermal paste application will enhance the conduction of heat from CPU to the bottom casing. Poor thermal paste application insulates the enclosure, and the perceived effect is a low[er] bottom case temperature (while the CPU is being fried on the inside)
I am trying to decide whether to do it or not.
My idle temp is 42-45 and any light surfing quickly gets me to 52-55 C.
Now if I can get it down like 5 degrees C and thereby increase battery life it would be worth it but not if it would heat up the bottom case since I like to use it on my lap. Was hoping for the opposite actually that it would distribute the heat more evenly and reduce vase bottom temp with AS5.
Maybe Coolbook is better solution all around?
Thanks
My idle temp is 42-45 and any light surfing quickly gets me to 52-55 C.
Now if I can get it down like 5 degrees C and thereby increase battery life it would be worth it but not if it would heat up the bottom case since I like to use it on my lap. Was hoping for the opposite actually that it would distribute the heat more evenly and reduce vase bottom temp with AS5.
Maybe Coolbook is better solution all around?
Thanks
