The size of the processor package says nothing about the size of the die within.
What it does say is that there are likely to be more I/Os into/out of the SoC.
This means that Apple could have integrated more functionality into the SoC directly that requires its own I/O.
But you can't say anything definite about the die within, whether or not it is larger, how many cores it has, and so on and so forth.
All you can do is speculate - if it's 28nm maybe there are four cores, and/or the cores run faster, and/or there are big.LITTLE companion A7s (so small they barely affect the die size, but they save a lot of power), and/or the GPU is bigger, and/or the memory controller is wider/faster ...