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Possibility of 3.2Ghz Nehalem Mac Pro?

Just saying...

Don't think upgrade to Nehalem yet, at least not on the Mac front. My current MP is doing just fine even though things take a little longer compared to the present systems but that doesn't mean I won't upgrade... I'm just waiting till those Intel® Core i9's (Gulftown) hit the market place, they're 32nm, six-core processors based on the Westmere architecture which are destined to use the same x58 socket as your presents MacPro (2009).

Mmmmm Twelve-cores, should be interesting.
Wonder can the present logicboard handle them.

20090628-eatbqr4ekspptm75bhwttgybyk.jpg

or will it all end in tears?🙁
 
They're calling it Core i9.
😕
Core. i. nine.
😕

Ugh, just use the CODENAMES, you morons. They actually make more sense. The way you have it set up, Clarksfield sounds like it will be comparable to Gainestown.

And for those of you who don't know... it isn't. 😛
 
What clock speeds will be available with i9? Is it on time for a Q1 2010 release like is mentioned in the table?

Tutor, did you buy CPU's and just swap them to get a 3.2GHz system?
 
I need all the details on upgrading 8 core Nehalems

I just closed a deal on a pair of W5590s and will probably trade my trusted MP1,1 3,0GHz Octad for a MP4,1 2,26GHz Nehalem Octad.

I read Anand's blog on upgrading the Octad:

http://www.anandtech.com/mac/showdoc.aspx?i=3597&p=1

It is very comprehensive. One thing I seem to remember I read somewhere is another complication with the use of IHS equipped standard chips. The thermal sensor of the heat sink isn't reading properly and needs to be brought into contact by fitting a thermal pad between sensor and base. I do not find that in Anand's and Tutor's writings. Perhaps someone can help me there.
 
gugucom said:
I just closed a deal on a pair of W5590s and will probably trade my trusted MP1,1 3,0GHz Octad for a MP4,1 2,26GHz Nehalem Octad.

I read Anand's blog on upgrading the Octad:

http://www.anandtech.com/mac/showdoc.aspx?i=3597&p=1

It is very comprehensive. One thing I seem to remember I read somewhere is another complication with the use of IHS equipped standard chips. The thermal sensor of the heat sink isn't reading properly and needs to be brought into contact by fitting a thermal pad between sensor and base. I do not find that in Anand's and Tutor's writings. Perhaps someone can help me there.
Click to expand...
What are you looking for?
Additional direction (How-To), or recommendations for thermal pads? 😕
 
nanofrog said:
What are you looking for?
Additional direction (How-To), or recommendations for thermal pads? 😕
Click to expand...

I just can't find the original post. I want to prepare myself thoroughly for the job because a mistake like Anand's with the non clamped sockets would be very costly. I have blown enough hardware by now.
 
gugucom said:
I just can't find the original post. I want to prepare myself thoroughly for the job because a mistake like Anand's with the non clamped sockets would be very costly. I have blown enough hardware by now.
Click to expand...
Certainly understandable, given what's happened.

I'd pop off a PM or email to Tutor, and see what he can tell you.

I looked, and couldn't find it either. 🙁

But I also took a look at Intel's datasheet for the mechanical drawing.
Parts with IHS have a height of: 4.284 - 4.871 mm.
Naked: 2.389 - 3.026 mm.

So it seems you'd have a gap of 1.845 - 1.895 mm to fill with a thermal pad.

Not exactly what you hoping for perhaps, but useful I think. 😉 Check out bergquist, particularly the GapPad product line. I think it's just what you're looking for. Pay particular attention to the following variants:
2500S20
2500
A3000

I hope this helps. 🙂
 
Isn't it just the opposite? The current ones have no HIS and the ones he'll be adding have them. So he'll be dealing with a thicker part - not a thinner one that needs gap filling. Right? Or did I misunderstand?

I think he's talking about the regulators that surround the CPU. When the CPU is thicker the heat-sink no longer touches them - if indeed it ever did in the 1st place. There was some discussion about this a I recommended a thermal pad. The OP at that time thought it was a great idea and all but I have some questions as to whether or not it's actually needed.

Here: https://forums.macrumors.com/threads/738826/
 
Tesselator said:
Isn't it just the opposite? The current ones have no HIS and the ones he'll be adding have them. So he'll be dealing with a thicker part - not a thinner one that needs gap filling. Right? Or did I misunderstand?

I think he's talking about the regulators that surround the CPU. When the CPU is thicker the heat-sink no longer touches them - if indeed it ever did in the 1st place. There was some discussion about this a I recommended a thermal pad. The OP at that time thought it was a great idea and all but I have some questions as to whether or not it's actually needed.

Here: https://forums.macrumors.com/threads/738826/
Click to expand...

Thanks Tess, that was the issue I vaguely remembered. I agree with both nanofrog and you in the evaluation of the "gap". Currently there is no way to say if the gap needs to be filled to keep the regulators nice and cold. Tutor, who did the first 5580 rig was positive about it, but he never came back with feed back. I will plan for using the pads and get some of the material in.
 
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