The difference between CPUs and other parts is that most things Apple buys from third parties are off-the-shelf products. As long as they meet a certain spec Apple can buy them and integrate them. However, the CPU is one of the few more complex things Apple actually fully designs in-house.
Now, I am not a chip manufacturing expert, that’s why I’m asking this question. What I hear from people who actually do this sort of stuff for a living is that you can’t just send the same tape-out to both. A tape-out needs to be created specifically with the foundry’s requirements in mind. Obviously you could create two different designs for two different manufacturers but the overhead and engineering headache for Apple would be substantial and possibly not worth it for only 20% of the production run.
I’d like MacRumors to actually do some digging and speak with people who commission big CPU production runs to see how feasible all this speculation actually is. If MacRumors can reveal that all this talk by business analysts is utter nonsense it could be a good story.
It's not quite as bad. The chip design is done by hand. The layout is done by some clever software. _Then_ you usually go in and make some changes to help the layout software. TSMC will have told Apple something like "if you stay below 195mm2 then we get x chips from a waver, otherwise up to 203mm2 we go down to only y chips", so depending on how close Apple would be to the 195mm2 they would work to get it under the limit (or not) by helping the layout software. So the layout would have to be done twice, but the design is the biggest part of the job.
Those complaining about contactless in the UK, where do you live? London is contactless central and one could, in theory, use Apple Pay with US issued cards in the UK so Apple Pay will be an easy roll out, it's just whether or not banks will be on board.
Their technology isn't identical, so their design rules are not identical. If you sent the TSMC tape (which isn't a tape anymore but is still called that) to Samsung, they couldn't build it, and vice versa. The design (which transistors and how are they connected) is the same, but the sizes and minimum distances between these transistors is different.
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