first of all i wish everybody in this thread a happy new year.
but now back to my problem:
i got a hot-air station from a local dealer and some flux and kapton tape. but no matter how hard i tried, i did not get the solder to melt for a proper reflow. i tried tipping the side of the bga gently but it won't move.
@dadioh: what temperatures do you set on your station. and can you write down your procedure for a local reflow?
thanks in advance.
I set my hot air to 500 deg (highest setting it goes to). My station also adjusts the airflow rate and I set that around the middle setting. I want to make sure I don't blow small components out of place.
I tape off the areas around the device in question to shield them from direct heat as much as possible.
Before applying heat I apply flux to the contacts that I want reflowed. My flux dispenser has a needle tip so I can apply it underneath the BGA as well. I try and run it along the edge so that the flux wicks under the device. I then pre-warm the area by holding the heat up above the board about 6 inches and moving it around to get the general area heated up. I then gradually move in closer over a period of about 1 minute and then move the gun back and forth and circular motion around the area trying to get the heat up to the point of melting the solder. The first sign this is happening is when the flux starts to boil in the area and you can see some bubbling around the edges of the BGA. The amount of time it takes depends on the size of device but usually not more than a minute or two.
I then let it cool for at least 10 minutes or so before attempting to move the board to make sure all the connections are cooled and solidified.
Which device are you reflowing?