A20 Chips in iPhone 18 Models Again Rumored to Feature New Design

[MacRumors]

Apple's A20 chip in the iPhone 18 will be packaged with TSMC's Wafer-Level Multi-Chip Module (WMCM) technology, according to Apple supply chain analyst Ming-Chi Kuo. This change has been rumored by multiple other sources previously.

Apple would be moving away from TSMC's InFO (Integrated Fan-Out) packaging it uses currently.

It is unclear if this change will be limited to higher-end models, like the iPhone 18 Pro and the so-called "iPhone 18 Fold," or if it will extend to the standard iPhone 18 and iPhone 18 Air. Kuo's research note today mentioned a second half of 2026 timeframe, which is when the iPhone 18 Pro and foldable iPhone are expected to launch. The Information said the lower-end iPhone 18 models will not be released until spring 2027.

In any case, at least some A20 chips would have RAM integrated directly onto the same wafer as the CPU, GPU, and Neural Engine, rather than sitting adjacent to the chip and connected via a silicon interposer. This could contribute to faster performance for both overall tasks and Apple Intelligence, and longer battery life from improved power efficiency. A20 chips may take up less space in the iPhone compared to previous chips.

A20 chips are also expected to be manufactured with TSMC's 2nm process, which would also contribute to faster performance and improved power efficiency over A18 and A19 chips, which are or will be fabricated with TSMC's 3nm processes.

All in all, A20 chips in iPhone 18 models are shaping up to have significant underlying changes.

Article Link: A20 Chips in iPhone 18 Models Again Rumored to Feature New Design

 

[Gloor]

cancelling my iPhone 17 Pro preorder then

 

[turbineseaplane]

The only change I want to see...

"iPhone 18 Mini"

 

[t0rqx]

Cancelled my iPhone 17 preorder.

 

[t0rqx]

cancelling my iPhone 17 Pro preorder then

Its getting out of hand. I have been cancelling since iPhone 14.

 

[deconstruct60]

In any case, at least some A20 chips would have RAM integrated directly onto the same wafer as the CPU, GPU, and Neural Engine, rather than sitting adjacent to the chip and connected via a silicon interposer. This could contribute to faster performance for both overall tasks and Apple Intelligence, and longer battery life from improved power efficiency. A20 chips may take up less space in the iPhone compared to previous chips.

TSMC InFO Pop , which Apple has historically used, is already vertical.

https://www.tsmc.com/english/dedicatedFoundry/technology/InFO

There is also an InFO-OS. ( on substrate. ) which is another 'tab' on the above link. THe 'in' in Info was always about being 'integrated'. More a matter of which mechanism for integration.

More likely that Wafer-level Multi-chip Module (WMCM) packaging is switching to side by side. Both Logic and DRAM are 'attached' to a substrate chip ( 'wafer' ... in so much that the chip on bottom is larger than the the chips being attached on top).

The InFo-POP involves creating that 'canyon' in the blue/black area above. If just bond the two smaller chips to the larger substrate chip then do not have to 'build up' that support foundation structure to host the DRAM on. Also limited in how many wires can run to the DRAM on top if logic chip is 'large-ish' relative to the DRAM .

Switching to 'side-by-side' would be moving toward what the M-series has always used.

Two-dimensional 'space savings' is probably not happening. Some chance that the overall volume might go down if had to keep the height over the 'logic' higher to deal with thermal issues (e.g., can't attach a heat sink directly to the logic chip. ) . The two dimensional bloat of the phones over time contribute to enabling that change in trade-off. Also what get is incrementally 'thinner' .

If Apple is going to be pushing. A-xx-Pro chips into service as Mac SoCs then bounding the logic chip with disconnection from heat sink makes even less sense.

 

[Plutonius]

Apple should name the chip A26 in accordance with their concept of jumping right to iOS 26 .

 

[DrWojtek]

They should name them A55 in accordance with liquid ass

 

[name99]

TSMC InFO Pop , which Apple has historically used. is already vertical.

View attachment 2536856

https://www.tsmc.com/english/dedicatedFoundry/technology/InFO

There is also an InFO-OS. ( on substrate. ) which is another 'tab' on the above link. THe 'in' in Info was always about being 'integrated'. More a matter of which mechanism for integration.

More likely that Wafer-level Multi-chip Module (WMCM) packaging is switching to side by side. Both Logic and DRAM are 'attached' to a substrate chip ( 'wafer' ... in so much that the chip on bottom is larger than the the chips being attached on top).

The InFo-POP involves creating that 'canyon' in the black area above. If just bond the two smaller chips to the larger substrate chip then do not have to 'build up' that support foundation structure to host the DRAM on. Also limited in how many wires can run to the DRAM on top if logic chip is 'large-ish' relative to the DRAM .

Switching to 'side-by-side' would be moving toward what the M-series has always used.

Two-dimensional 'space savings' is probably not happening. Some chance that the overall volume might go down if had to keep the height over the 'logic' higher to deal with thermal issues (e.g., can't attach a heat sink directly to the logic chip. ) . The two dimensional bloat of the phones over time contribute to enabling that change in trade-off. Also what get is incrementally 'thinner' .

If Apple is going to be pushing. A-xx-Pro chips into service as Mac SoCs then bounding the logic chip with disconnection from heat sink makes even less sense.

Another factor is once Apple control the radio chip(s), they have more flexibility in setting up the whole package. If they can mount the radio chip(s) closer to the SoC they save some transfer power as compared to radio on the PCB? But then you have issues of how you route in the analog signal...

Obviously I have no idea what the optimal tradeoffs are for these different options! But something like this might be driving a rethinking of just what goes into the primary "SoC package".

 

[acuriouslad]

Sounds like it could get hot, hope thermal management and new heat sinks are also in the cards

 

[MRrainer]

I don't think I can use my XR that long.
Problem is, the current generation just doesn't really entice me.
Stupid colors.
Horribly large camera bumps.

Why can't they make another nice phone like the iPhone XR? How hard can it be?

 

[xmach]

I don't think I can use my XR that long.
Problem is, the current generation just doesn't really entice me.
Stupid colors.
Horribly large camera bumps.

Why can't they make another nice phone like the iPhone XR? How hard can it be?

Apple already has made a nice phone comparable to the XR -- it's called the iPhone 16e. If you're still rocking a XR, the 16e will likely suit most of your needs. It would be a major upgrade in terms of technical capabilities, and as a bonus, it's also smaller (in all 3 dimensions) and lighter, with the same 6.1" screen size. The only major reason I can think of not to get a 16e is its lack of MagSafe, but you already don't have that on your XR.

 

[iPay]

For some reason, better power efficiency always translates to more heating and less battery life. Go figure.

 

[miku2002]

The only change I want to see...

"iPhone 18 Mini"

A mini will not succeed again unless it is also the budget option. It's almost impossible to break the average customer's perception of bigger = more expensive and smaller = less expensive. As long as the iPhone 16e exists, it will cannibalize any sales of the mini, just like the SE cannibalized sales of the 12 mini and 13 mini. The only time a mini-form factor iPhone has ever succeeded was when it was also the cheapest entry-level phone. So dreams of an 18 mini or delusions of an 18 pro mini will never come to pass.

 

[SFjohn]

The only change I want to see...

"iPhone 18 Mini"

It’s never going to happen because it doesn’t sell enough. Try this:

soyes Mini Phone World's Smallest 3.0" HD Touch Screen Mini Smartphone Unlocked Android Compact Mobile Phone for Kids &Students Cell Phone wih Quad-Core Dual SLM Face lD2GB+16GB Blue

This super-mini phone combines convenience, functionality and charm. At only 3.54 inches long and 1.97 inches wide, it fits perfectly in the palm of your hand and is easy to carry. It has a 3G network that simplifies communication by providing stable call and text services. Not only does this com...

www.amazon.com

 

[Dark_Omen]

Just slap an M series chip in it and be done. It’s gotta be cheaper to just process M series chips right? Instead of putting A series chips in the basic iPad and iPhone, and M series in everything else.

 

[svish]

Expecting to see the usual speed improvement along with power efficiency. Power efficiency will be needed as I will not be surprised if the foldable is having a small battery.