http://biz.yahoo.com/iw/051025/098977.html
SAN JOSE, CA--(MARKET WIRE)--Oct 25, 2005 -- At Fall Processor Forum in San Jose, California today, IBM announced the custom designed microprocessor built for Microsoft's Xbox 360 console is in production at the company's East Fishkill, N.Y. fab and at Chartered Semiconductor Manufacturing in Singapore. Together, IBM and Chartered's common platform offers Microsoft a unique dual-source capability that provides the highest level of manufacturing redundancy and flexibility.......
The chip features a customized version of IBM's industry leading 64-bit PowerPC core. The chip includes three of these cores, each with two simultaneous threads and clock speeds greater than 3 GHz. It features 165 million transistors and is fabricated using IBM's 90 nanometer Silicon on Insulator (SOI) technology to reduce heat and improve performance. The chip's innovative 21.6 GB/s Front Side Bus (FSB) Architecture was customized to meet the demanding throughput and latency requirements of the Xbox 360 gaming platform software.
Other Xbox 360 chip features include:
-- 3 identical multi-threaded PowerPC-based CPU cores operating at 3.2 GHz enhanced with specialized function VMX acceleration for gaming applications and a high speed 128-bit vector unit
-- 1 MByte Shared L2 Cache with custom logic for high-speed data streaming for graphics and system applications
-- 5.4 Gb/s per-pin Front Side Bus (with an aggregated bandwidth of 21.6 GBs)
-- Highly configurable and programmable utilizing eFUSE technology
SAN JOSE, CA--(MARKET WIRE)--Oct 25, 2005 -- At Fall Processor Forum in San Jose, California today, IBM announced the custom designed microprocessor built for Microsoft's Xbox 360 console is in production at the company's East Fishkill, N.Y. fab and at Chartered Semiconductor Manufacturing in Singapore. Together, IBM and Chartered's common platform offers Microsoft a unique dual-source capability that provides the highest level of manufacturing redundancy and flexibility.......
The chip features a customized version of IBM's industry leading 64-bit PowerPC core. The chip includes three of these cores, each with two simultaneous threads and clock speeds greater than 3 GHz. It features 165 million transistors and is fabricated using IBM's 90 nanometer Silicon on Insulator (SOI) technology to reduce heat and improve performance. The chip's innovative 21.6 GB/s Front Side Bus (FSB) Architecture was customized to meet the demanding throughput and latency requirements of the Xbox 360 gaming platform software.
Other Xbox 360 chip features include:
-- 3 identical multi-threaded PowerPC-based CPU cores operating at 3.2 GHz enhanced with specialized function VMX acceleration for gaming applications and a high speed 128-bit vector unit
-- 1 MByte Shared L2 Cache with custom logic for high-speed data streaming for graphics and system applications
-- 5.4 Gb/s per-pin Front Side Bus (with an aggregated bandwidth of 21.6 GBs)
-- Highly configurable and programmable utilizing eFUSE technology
I also hope that microsoft paid plenty of attention to cooling; if the new xbox runs as hot as a G5 there are going to be lots of BTUs around dry Christmas trees this winter, if you know what I'm saying. 
