Hi All,
As I have upgraded my mac pro 2009 to 5,1 and put 2x X5650 2.66 inside. I found the fan issue and the CPU temperature idle is from 44-50C. Booster Fan speed always round 1300-1500.
I have installed the fan control and it is improved the fan speed in idle.
What I have in mind that: May I remove the IHS of X5650 and use the old method put the plastic plate in between CPU and heat sink?
Reason i want to do it:
1. it should remove the 2mm different in 2009 mac pro.
2. the die is direct contact with heat sink should be better than though the IHS.
But I wonder If it is fit the thickness in between the die and the plastic plate...
Anyone know?
As I have upgraded my mac pro 2009 to 5,1 and put 2x X5650 2.66 inside. I found the fan issue and the CPU temperature idle is from 44-50C. Booster Fan speed always round 1300-1500.
I have installed the fan control and it is improved the fan speed in idle.
What I have in mind that: May I remove the IHS of X5650 and use the old method put the plastic plate in between CPU and heat sink?
Reason i want to do it:
1. it should remove the 2mm different in 2009 mac pro.
2. the die is direct contact with heat sink should be better than though the IHS.
But I wonder If it is fit the thickness in between the die and the plastic plate...
Anyone know?