http://www.notebookcheck.net/Newsentry.153+M5dae24f438d.0.html
Along with a better layout of components inside the MacBook Pro (currently almost the same for 7 years), a case better designed for heat dissipation, better thermal paste (currently poorly applied and far from the most effective), this new fan, if used in the new MacBook Pros, could conceivably increase the quality of cooling of the notebook hugely.
One of the reasons the MacBook Pro lags so far behind it's PC competitors in terms of graphics is because Apple insists it's high end notebook line must be 1" thick, making using anything but a low-mid-range GPU impossible due to heat issues.
Perhaps this could change that?
Is this tech too early for the new MBPs? Would Apple have had the ability to adopt earlier so as to be ready for manufacture?
Besides the new Core i7 processor and wireless power transmission Intel presented smaller innovations at the Intel Developer Forum as well. For example, a prototype of a new notebook fan.
This notebook fan is ultra thin and is twice as effective as a common fan, but it needs the same power and produces the same noise like a common one. Supposedly, the new fan will be available soon for notebook manufacturers which use Intel CPU’s.
Along with a better layout of components inside the MacBook Pro (currently almost the same for 7 years), a case better designed for heat dissipation, better thermal paste (currently poorly applied and far from the most effective), this new fan, if used in the new MacBook Pros, could conceivably increase the quality of cooling of the notebook hugely.
One of the reasons the MacBook Pro lags so far behind it's PC competitors in terms of graphics is because Apple insists it's high end notebook line must be 1" thick, making using anything but a low-mid-range GPU impossible due to heat issues.
Perhaps this could change that?
Is this tech too early for the new MBPs? Would Apple have had the ability to adopt earlier so as to be ready for manufacture?