The PowerMac enclosure

[greatm31]

This is just another idle wondering thread, but does anyone have a thought as to what will become of the present brilliantly engineered PowerMac G5 enclosure? The thing is designed to dissipate heat from the G5 through the 10,000 discrete cooling zones (or 5 or whatever) and Apple probably invested lots of money and time into it. Will it even be useful or remotely necessary for future Intel chips? I hear the Pentium 4 runs hot. Really hot. So who knows.

 

[dejo]

Just realize that the new Power Macs will probably not be running Pentium 4s...

 

[ArcticFox]

Well...I wonder how well the G5 tower would cool P4's? Obviously the fan speeds would have to be jacked up and better heatsinks installed, but it'd be an interesting experiment.

 

[greatm31]

Just realize that the new Power Macs will probably not be running Pentium 4s...

Yes, that's true. I suppose I'm fishing for some advantages Apple might have over other Intel customers... so that perhaps Apple could overclock a processor that Dell couldn't ship for heat reasons, for example.

 

[dejo]

Well...I wonder how well the G5 tower would cool P4's? Obviously the fan speeds would have to be jacked up and better heatsinks installed, but it'd be an interesting experiment.

Once the new dev kits make their way into the hands of developers (shipping in 2 weeks), we may hear more details, assuming these dev kits are enclosed in a Power Mac G5 case...

 

[yellow]

It might be a 50/50 shot at changing them.

Remember that the basic external design of the G4 was constant from the G3 B&W thru the MDD.

It's possible that the chasis for the G5 will remain constant too. At least for a while. But, will Apple call the next chip the G6? Or will they completle abandon that moniker? If the do call it a G6 (or even if they don't), wil that warrant a new chassis design?

Only time will tell.

Of course, the 1st MacIntel offering will be a tablet PC called iMacblet.

 

[_bnkr612]

iMacblet.

Good humor.