I did a quick Google search to see if there were any articles that might touch upon the fact that the new unibody Macbooks/MBP's have a much lower thermal envelope; I would suspect that the ability to dissipate heat in a unibody is much greater than the cases of previous generations.
Unfortunately, the results back from Google were mostly articles about problems with the 17' MBP GPU issues and thermal paste being applied incorrectly.
Does anyone know of an article that has data with respect to the unibody's ability to dissipate heat?
I have a theory that in the long run this would generate a lower failure rate for GPU's and logic boards on the computer. Less heat is typically a good thing for a laptop.
Thanks.
Unfortunately, the results back from Google were mostly articles about problems with the 17' MBP GPU issues and thermal paste being applied incorrectly.
Does anyone know of an article that has data with respect to the unibody's ability to dissipate heat?
I have a theory that in the long run this would generate a lower failure rate for GPU's and logic boards on the computer. Less heat is typically a good thing for a laptop.
Thanks.