A little bit of background first: I had picked an iphone 15 pro max for my wife during a trip to the US a couple of months ago (prices for the pro/pro max are about 30% lower vs my country)
The new phone has exhibited noticeably higher levels of heating episodes than the older one (13 pro max)
Now I understand that it's not uncommon but what I am unsure of is whether its because of software issue on a new chip (thus fixable in the future) or on account of hardware issues (the so called silicon lottery)
Now I have a trip to the US coming up again in two weeks and am wondering if I should raise a replacement claim . Raising the same in my country, while feasible may not be straightforward, esp because the SKUs this year are slightly different (since the US model is esim only) which can cause issues if raising a claim outside the US. Either way, claiming a replacement will be a hassle so I am wondering if there is an objective way to test heating issues.
One way I could think is running a stress test like 3dmark and checking if the scores are in line with the median for this model.
Either way, what I am hoping for is a way to figure out if the episodic occurences are down to some software gremlins (which will get fixed in due time hopefully and a replacement wont help anyway)
or if its a problem isolated to specific batches / units in which case the hassles associated with this would be worthwhile.
Any thoughts?
Edit (11th Dec) : Post #7 has a screenshot of my extended thermal stress test using 3dmark.
Sine there aren’t too many baseline samples to compare against, it may not be useful for other users in doubt to post theirs
The new phone has exhibited noticeably higher levels of heating episodes than the older one (13 pro max)
Now I understand that it's not uncommon but what I am unsure of is whether its because of software issue on a new chip (thus fixable in the future) or on account of hardware issues (the so called silicon lottery)
Now I have a trip to the US coming up again in two weeks and am wondering if I should raise a replacement claim . Raising the same in my country, while feasible may not be straightforward, esp because the SKUs this year are slightly different (since the US model is esim only) which can cause issues if raising a claim outside the US. Either way, claiming a replacement will be a hassle so I am wondering if there is an objective way to test heating issues.
One way I could think is running a stress test like 3dmark and checking if the scores are in line with the median for this model.
Either way, what I am hoping for is a way to figure out if the episodic occurences are down to some software gremlins (which will get fixed in due time hopefully and a replacement wont help anyway)
or if its a problem isolated to specific batches / units in which case the hassles associated with this would be worthwhile.
Any thoughts?
Edit (11th Dec) : Post #7 has a screenshot of my extended thermal stress test using 3dmark.
Sine there aren’t too many baseline samples to compare against, it may not be useful for other users in doubt to post theirs
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