Apple supplier TSMC is making strides to improve its production capacity for chips based on its cutting-edge 3-nanometer process technology, according to industry sources, which is expected to debut in this year's iPhone 15 Pro and upcoming MacBook models.
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DigiTimes reports that TSMC's 5nm fabrication capacity began to loosen in November 2022 as a result of reduced orders from Apple, amongst other partners, with orders for iPhone chips alone having been slashed by 30%. However, the Taiwanese manufacturer has apparently been able to keep its utilization rate at 70% or higher thanks to Apple's thirst for 3nm:
TSMC continues to improve its capacity utilization for 3nm process technology, which is expected to approach 50% at the end of March, the sources said. The foundry will also grow the process output to 50,000-55,000 wafers monthly in March, with Apple being the main customer.