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is this for the 4.7 inch iphone 6,
hoping it will get 2GB ram, or maybe 3GB.
 
One of these days, they will re-assemble a working iPhone before launch, from all the leaked parts.
 
WiFi, flash storage, and a processor? Yep, that’s all I need in a phone. Ship it already!

…wait, waddya mean there’s more?
 
A quick comparison b/w iPhone 5s motherboard with this.
Image
New A8 is supposed to be smaller but the module is of same size as A7. Maybe they will bump up memory?!

Curious to see the A8 shielding section still same size as A7. Also - the extra bit at the bottom too?
From an iPhone 5s teardown https://www.ifixit.com/Teardown/iPhone+5s+Teardown/17383 Step 12- 15 shows the chips in that section for the iPhone 5s, Broadcom BCM4334 etc. So that's where you might expect the BCM4354 or WTR1625L type chips. Galaxy S5 went with the QCA6174 and no resonance charging, instead a charging cover. No details on the Galaxy Note 4 yet.

Personally i'm wondering if Apple is bringing in resonance wireless charging - but you'd need to have an idea of the chips and sizes for that - Broadcom can at least support it on their new BCM4354 802.11ac chip. http://appleinsider.com/articles/14...ac-2x2-mimo-could-be-tapped-for-future-iphone www.broadcom.com/press/release.php?id=s827695
 
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Why didn't they pry the metal shielding off?? This is about as frustrating as the "signing your posts with a D" yesterday, lol.
 
I'll die happy if apple decided to put 2gb of ram in the next iphone.
 
Curious to see the A8 shielding section still same size as A7. Also - the extra bit at the bottom too?
From an iPhone 5s teardown https://www.ifixit.com/Teardown/iPhone+5s+Teardown/17383 Step 12- 15 shows the chips in that section for the iPhone 5s, Broadcom BCM4334 etc. So that's where you might expect the BCM4354 or WTR1625L type chips. Galaxy S5 went with the QCA6174 and no resonance charging, instead a charging cover. No details on the Galaxy Note 4 yet.

Personally i'm wondering if Apple is bringing in resonance wireless charging - but you'd need to have an idea of the chips and sizes for that - Broadcom can at least support it on their new BCM4354 802.11ac chip. http://appleinsider.com/articles/14...ac-2x2-mimo-could-be-tapped-for-future-iphone www.broadcom.com/press/release.php?id=s827695

What makes no sense to me is the top part, just above the CPU. The sockets in the arrangement of this, don't have ample clearance as compared to sockets in 5S. The connector strips will overlap in this. I think it is fake.

Additionally in the top sockets part of 5S, behind the central empty part lies m7 which cannot be accommodated in this. So maybe A8 is having m8 core inbuilt or shifted somewhere else maybe next to A8.
 
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To me - this daily reporting of minor leaks of parts is somewhat pointless.

To you possibly yes. But this is what rumour websites do. And I think these part leaks are really interesting. Much more than the patent wars or app advertising.
 
Phil: Time to leak a bit about the new iPhone to convince the public?
Tim: Go ahead. :cool:
 
- logic board
- minor part

Pick one. And with respect you're on an Apple rumour site. We haven't yet seen a fully assembled Logic Board for the iP6. I'll agree there have been a lot of leaks recently, but that goes with the territory of being a rumour site.

To be fair, the “minor” in his sentence modifies “leaks”. :D
 
It would be interesting to see the battery leak. Then we might be able to guess whether the iPhone 6 will offer substantially better battery life
 
I don't know much about the logic board, but I can tell it was leaked by Chinese personnel.
 
so basically someone decided to make a picture of this and all the interesting stuff is not visible? great :p

$$ for this.. and $$$$ for one heat spreader removed tomorrow.. and $$$$$ for everything the day after! The game is as old as time itself... :)
 
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