Well thats an interesting development. The "it'll be out soon" part probably warrants the usual Intel disclaimer of late.
Not really in this case. Xeon SP dies were suppose to come out in 2H20. At this point we are almost to 2H21. There has already been a delay. The Xeon SP 3rd Gen Ice Lake product is already out.
https://ark.intel.com/content/www/us/en/ark/products/codename/74979/ice-lake.html#@Server
The Xeon W 3300 series parts will simply use binned versions of those exact same dies with some features turned off/on (and possibly a different package. ) '
Vendors are already shipping Xeon SP 3rd Gen Ice Lake systems:
New Tyan 3rd Generation Intel Xeon Scalable Ice Lake servers bring PCIe Gen4 to Tyan's Intel Xeon customer base
www.servethehome.com
www.anandtech.com
So the only question here now is only which package toss the die into. The new or "old socket' and when there are are enough "extra" , binned dies to allocate to the xeon W series product line. If Intel is trying to match the new higher max core count then the socket is likely the same. So really probably just boils down to supply allocation problem.
It is not whether can entry volume production or not. That happened back in January.
In this piece, Intel says Ice Lake Xeons are now in production. We go a step further and describe how we will label future launch statuses
www.servethehome.com
Really more a matter of when get to better supply/demand balance. ( AMD growing server share probably has some impact of making more of these dies available as get deeper into this year; not less). It won't be surprising if Intel does a somewhat soft roll out on this at Computex at end of May or it happens in June. July-August is there is some chip supply problem.
Intel waiting until the AMD Threadripper Zen 3 really gets heavily going is only going to make it worse for them. Waiting for Sapphire Ridge ( gen 4) in this product space would just be digging a deeper hole.
There is a decent chance that Apple put work into a iMac Pro update with this. Back in 2017-2018 this was suppose to be out in 2019. That then slide to 2020 . if Apple thought it was going to slide to 2020 back then then it could have rolled out with the 27" iMac update in August 2020 as one of the "stop gap" transitionary large screen iMacs.
The Xeon W-3300 is problematical for the iMac Pro because the TDP went up in the final version of the product. Coupled with probably also TDP growth in AMD GPU options that probably stalled out the iMac Pro update (plus greater overalp with the 2020 iMac 27" ). However, if Apple did the ground work for the CPU-chipset already then that could be shifted over to the Mac Pro also if they need lots more time for a "full tower" version of a M-series solution.
The Mac Pro 2019 chassis can probably absorb the CPU TDP bump.
It is a viable option for a 2H21 system release. If Apple is pushing Navi2 MPX updates in 2021 then makes even less sense to leave the CPU stuck at PCI-e v3 option for GPU's that max out at PCI-v4 (even more so if want to leverage "Smart access memory" in these new GPUs. )