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First Photo of Apple's A10 Chip for iPhone 7 Appears With Mid-July Production Date

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Less than one month before Apple is expected to announce the iPhone 7 and iPhone 7 Plus, Chinese repair shop GeekBar has shared the first photo of what appears to be the next-generation A10 chip destined for the smartphones on Weibo. The number of pins appears to be consistent with the A9 chip's 64-bit LPDDR4 interface.

While the photo could easily be faked, the chipset is labeled with a 1628 date code, corresponding with mid-July production. Additionally, GeekBar has accurately leaked components for unreleased Apple products in the past, including the iPhone 6s display assembly and iPhone 6 schematics showing a 128GB storage option.

A10-chip.jpg

What is pictured here is not the complete A10 chip and may be the RAM layer that is stacked on top of the A10 wafer as one system-on-a-chip, rather than the processor itself. Apple A-series chips are typically labeled on all four edges, suggesting this chipset is in a mid-production state.

TSMC is expected to be the sole supplier of Apple's faster A10 chip based on its 16nm FinFET WLP process. The new processor should bring performance improvements to the iPhone 7 and iPhone 7 Plus. The smartphones are expected to be announced on September 7 and released on September 16.

Last year, TSMC-built A9 chips were found to outperform Samsung-built A9 chips in early iPhone 6s battery benchmarks, but subsequent tests showed less significant impacts that Apple later said amounted to only a 2-3% difference in "real world" battery life. Samsung is not expected to be an A10 chip supplier.

Article Link: First Photo of Apple's A10 Chip for iPhone 7 Appears With Mid-July Production Date
 
Article Link
https://www.macrumors.com/2016/08/10/apple-a10-chip-first-photo-weibo/
The most leaked iPhone since iPhone 4? lol

I was initially really excited for the iPhone 7, and have been waiting to upgrade my now dated iPhone 5s, but I'm now going to wait yet another year for the 2017 iPhone. I do hope, however, that Apple has plenty of tricks up its sleeves to make the iPhone 7 better than it looks.
 
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There's only text on two sides of the package (the name on one side, and production details, lite date on the other), that means that RAM isn't included in the package like it use to. The RAM-less versions use to be the X versions. My guess is that the name will be APL1030.

Edit:
However.. the pin-out is not consistent with a package lacking RAM. The are just too few pins.
 
Can't wait to see the CPU/GPU power with the dual camera model. Any bump in power and efficiency is welcome to me. :)
 
Where are all the pins (balls)? There's way too few pins for a CPU, check out the pictures of a iPhone 6 logic board. This looks like the right amount for RAM, which makes sense since the iPhone always used package-on-package and the RAM was on top.

So this really doesn't tell you anything about the CPU. It's just RAM they stuck in a custom package.
 
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iThingsGurl said:
The only thing left for the keynote day is Tim's faux-excited excitement of how excited he is for the exciting things ahead.
Click to expand...
Yeah. I def get all excited when I hear corporate execs yammer about their fake excitement. Lol...they really do need to come up with more than one adjective about these things. Wouldn't be hard get a damn thesaurus.
 
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