Regarding thermal paste on a G4 PowerBook Ti, I must confess that when I disassembled and re-built mine a short while ago (a 667MHz model) I didn't re-apply any thermal paste. The bottom of the computer gets pretty hot (it did that when new), fan comes on after a while, but has never had a thermal-controlled shut-down.
I've just checked my disassembly photos and note what looks like 3 possible locations on the rather large and complex heat-sink, 1 with thermal paste and 2 with thermal pads. Would it be acceptable to apply thermal paste to all three locations?

I've just checked my disassembly photos and note what looks like 3 possible locations on the rather large and complex heat-sink, 1 with thermal paste and 2 with thermal pads. Would it be acceptable to apply thermal paste to all three locations?
