The Register delves a bit into some details of two new manufacturing techniques that IBM has developed.
The two new technologies, 'Strained Silicon Directly on Insulatar' (SSDOI) and Hybrid Orientation Technique (HOT), allow IBM to increase performance (by 40-65%) and decrease power requirements of future chips.
The techniques are being presented at the Internaltion Electron Devices Meeting in December of this year, and is expected to be commercially implemented in the next few years.
IBM manufactures the PowerPC 970 (G5) for Apple's PowerMac line as well as the G3 processor, currently used in the iBook.
The two new technologies, 'Strained Silicon Directly on Insulatar' (SSDOI) and Hybrid Orientation Technique (HOT), allow IBM to increase performance (by 40-65%) and decrease power requirements of future chips.
The techniques are being presented at the Internaltion Electron Devices Meeting in December of this year, and is expected to be commercially implemented in the next few years.
IBM manufactures the PowerPC 970 (G5) for Apple's PowerMac line as well as the G3 processor, currently used in the iBook.