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A smart "leak" if you were trying to sell off the last bit of iPhone 4 stock. I personally have been holding out on a replacing my wife's busted iPhone 4 until falls iPhone 5 but clearly they won't have one then? BS. It shows up. That's where my bet is.
 
So, how exactly does one qualify "minor" vs "major" changes? Until now, we've heard fairly routinely that the next iPhone will get an 8MP camera, an A5 chip, and HSPA+ support. While that is quite a bit of horsepower, a lot of people still qualify that as "minor" upgrades and will only qualify it as a major upgrade if the case is changed.

Jesus, since when is a much faster CPU/GPU, twice as fast network speeds and almost 2x as better of a camera, a minor update for a phone!? What are we expecting, nuclear powered and doubles as a hover board?
 
Jesus, since when is a much faster CPU/GPU, twice as fast network speeds and almost 2x as better of a camera, a minor update for a phone!? What are we expecting, nuclear powered and doubles as a hover board?

oh i love the hover board idea...
 
lol

Apple is all about flash and cool. No way do they delay the release of their most popular product without a huge upgrade. It'd be a major "What the hell ..." moment for average consumers, and Steve Jobs would not let that happen. He is, after all, a computer guy with an excellent mind for PR.


actually i dont think apple is "all about flash" cause they still dont have flash on their phones yet.... lol just felt like making a pun
 
You realize that the enclosure people and the chip design people are different right? They've probably never even met.
Shouldn't matter. The chip design people are supposed to produce a part with a specific thermal design power (TDP) rating.

The thermal design engineers plug in all the numbers (including the enclosure specifications) into a computational fluid dynamics (CFD) program and run the simulation.

Sure, the theoretical design would be verified with physical prototype units in a lab, however, I find this rumor implausible. After all, if it's the same SoC as what's in the iPad 2, Apple should be highly aware of the A5's characteristics.
 
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Oh no! This could be the misstep that allows RIM to retake the smartphone leadership crown!!!!!

400x.jpg
 
Shouldn't matter. The chip design people are supposed to produce a part with a specific thermal design power (TDP) rating.

Sure, the theoretical design would be verified with physical prototype units in a lab, however, I find this rumor implausible. After all, if it's the same SoC as what's in the iPad 2, Apple should be highly aware of the A5's characteristics.

Yep. This rumor has to be highly suspect. As far as I can tell, the TDP of the A4 was 1W, and the A5 is 0.5W. That's not gonna cause a heat issue.
 
I still don't buy the iPhone 4S rumors. If they were going to release a "small" spec bump for the iPhone, they would have done so on their normal release schedule. They don't break with tradition, knowing that lots of 3GS owners will be coming off contract, to leave that group waiting around for months on a minor upgrade. Minor updates are easy, and don't require Apple to delay their release.
 
Lol, imagine your iPhone just bursting into flames out of nowhere.:D That's the thought I had when I read "overheating."
 
Funny. My iPad 1 would overheat all the time when used in the Sun. I've been using my iPad 2 outside in the Sun on way hotter days and haven't had it overheat once. I thought the a5 was running cooler due to this reason.
 
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Lies. The upcoming iPhone is very likely the iPhone 5. iOS 5, iPod touch 5th gen etc. It's marketing. And I highly doubt they'll change the screen size.
 
Some have suggested that the confusion stems from Apple testing the substantially-revamped iPhone 5 internals within iPhone 4-like enclosures for secrecy, ...

Last year, Apple's secrecy fetish allowed the iPhone 4 antenna mistake to slip through, all because test phones were wrapped in fake 3GS cases.

This year, maybe they're finding out that faster chips work fine when enclosed in an iPhone 4 case for secret tests, but overheat in the actual production iPhone 5 shell.

Dear Apple: just make each new device as it's supposed to be made, then stick on a fake "Samsung" label to satisfy the curiosity of any accidental observers. There you go: instant test secrecy and no mistakes. You're welcome. :)
 
Last year, Apple's secrecy fetish allowed the iPhone 4 antenna mistake to slip through, all because test phones were wrapped in fake 3GS cases.

This year, maybe they're finding out that faster chips work fine when enclosed in an iPhone 4 case for secret tests, but overheat in the actual production iPhone 5 shell.

Dear Apple: just make each new device as it's supposed to be made, then stick on a fake "Samsung" label to satisfy the curiosity of any accidental observers. There you go: instant test secrecy and no mistakes. You're welcome. :)

you think because they used fake 3gs shells out in public, they never tested the antenna in any other way??? haha ok....
 
I've been thinking this all along. Think about it. The iPad 2's chip is a lot bigger than the one in the iPhone. They need to move to smaller die sizes. This will not only create a smaller chip but one that is more energy efficient.

This could give slightly more credence to the idea of an iPhone 5/ iPhone 4S/lite or whatever. Two models, one with a larger screen. Perhaps the slightly larger enclosure would make room for the chip and give it more breathing room as far as heat dissipation?

It's a good thing they never thought of that in their Chip roadmap.

Come on now, the chip die targets have been set a year in advance. Most certainly this version of the A5 is not a straight drop in from the iPad 2.
 
I don't buy the iPhone 4s rumor as well. It would piss off a lot of customers. The 5 is long overdue. I love my 4, but it is time to move on. :D
 
you think because they used fake 3gs shells out in public, they never tested the antenna in any other way??? haha ok....

The first two paragraphs were what we call the set-up. The last paragraph was what we call the punchline. By their powers combined, we have a joke.
 
you think because they used fake 3gs shells out in public, they never tested the antenna in any other way??? haha ok....

knowing Apple chances are yes they did not properly test the design. The bigger issue with the antenta was how Apple denied denied denied it being a problem even in the end it was worse. I would not be surpised in the least to find out that the drop call rate was a near a 50%+ jump over the 3gs. (remember Apple said less than 1 per 100 over the 3GS but that number is useless unless we know what the 3GS drop rate call rate was. I am willing to bet the 3GS drop call rate was with in norms and was under 1 per 100.

Apple screwed up in the design and it was acting like it was not an issue that blew up in their face and the fake that it would be done with a pinky.

As for kdarling suggestoin yeah Apple could easy cover it up from happening again by slapping lets say Motorola, LG or Samsung label on the test device and no one would be the wiser.
 
My iPad 2 isn't feeling terribly hot, and with a similarly thin form factor, why would it be a greater problem on an iPhone 5? I assume the A5 chip has identical size in both cases. Is it harder to provide good heat dissipation in the iPhone? Just trying to understand the issue here as a novice. :p

Well your iPad 2 has a very large surface area to dissipate the heat over, in comparison the iPhone is a tiny and cramped environment, and heat will build up.
 
POWER BOOK G5 REINCARNATEEEE!!!!! :eek: :(

I really hope this is not true. But I am not getting the next iPhone. I have the iPhone 4 and I have found upgrading every other year is working just fine :) I will definitely enjoy iOS 5 on my iPhone 4 though! :cool:
 
My iPad 2 isn't feeling terribly hot, and with a similarly thin form factor, why would it be a greater problem on an iPhone 5? I assume the A5 chip has identical size in both cases. Is it harder to provide good heat dissipation in the iPhone? Just trying to understand the issue here as a novice. :p

Ipad chip is larger in physical size that mean that it dumps heat better and compressing the size of the chip could easily increase the heat from the chip so now you have less area to dump the heat and a lot more to deal with.
 
I guess that even if the processor is bigger, therefore dissipates heat better, that heat has to go somewhere, ie into the case. But as mentioned earlier, im sure apple knows the thermal dissipation of any case they're making.
 
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