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Is it possible to have CPU/GPU/WIFI/LTE/RAM/FLASH on 1 Chip for iPhone?
- Thread starter DBZmusicboy01
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Yes and no. Logic, DRAM, NAND Flash and RF all uses different process technologies optimised for their uses. So at most you can have them tightly integrated in a single package, but hardly a single chip unless you are fine with a chip that has no competency. Eek.
Yes. But one reason is the probability of that chip having a defect during fabrication goes WAAYYY up.
You will also need more area for that chip. The bigger the chip, the less amount of chips you can have per wafer. And a defect means a small overall yield.
Here the black dots are defects:
So you can imagine a is just a CPU/GPU combo, and b is your super mega CPU/GPU/WIFI/LTE/RAM/FLASH chip.
You will also need more area for that chip. The bigger the chip, the less amount of chips you can have per wafer. And a defect means a small overall yield.
Here the black dots are defects:
So you can imagine a is just a CPU/GPU combo, and b is your super mega CPU/GPU/WIFI/LTE/RAM/FLASH chip.