Is it possible to have CPU/GPU/WIFI/LTE/RAM/FLASH on 1 Chip for iPhone?

Discussion in 'iPhone' started by DBZmusicboy01, Apr 2, 2015.

  1. DBZmusicboy01 macrumors 6502a

    Joined:
    Sep 30, 2011
  2. eelw macrumors 6502a

    eelw

    Joined:
    Sep 19, 2012
    #2
    Assuming you can find a manufacturer that makes all the necessary components to design that all in one chip. Well possibly Intel.
     
  3. Trahearne macrumors 6502

    Joined:
    Oct 6, 2014
    #3
    Yes and no. Logic, DRAM, NAND Flash and RF all uses different process technologies optimised for their uses. So at most you can have them tightly integrated in a single package, but hardly a single chip unless you are fine with a chip that has no competency. Eek.
     
  4. boast macrumors 65816

    boast

    Joined:
    Nov 12, 2007
    Location:
    Phoenix
    #4
    Yes. But one reason is the probability of that chip having a defect during fabrication goes WAAYYY up.

    You will also need more area for that chip. The bigger the chip, the less amount of chips you can have per wafer. And a defect means a small overall yield.

    Here the black dots are defects:

    [​IMG]

    So you can imagine a is just a CPU/GPU combo, and b is your super mega CPU/GPU/WIFI/LTE/RAM/FLASH chip.
     

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