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Discussion in 'iPhone' started by DBZmusicboy01, Apr 2, 2015.
To save power and space?
Assuming you can find a manufacturer that makes all the necessary components to design that all in one chip. Well possibly Intel.
Yes and no. Logic, DRAM, NAND Flash and RF all uses different process technologies optimised for their uses. So at most you can have them tightly integrated in a single package, but hardly a single chip unless you are fine with a chip that has no competency. Eek.
Yes. But one reason is the probability of that chip having a defect during fabrication goes WAAYYY up.
You will also need more area for that chip. The bigger the chip, the less amount of chips you can have per wafer. And a defect means a small overall yield.
Here the black dots are defects:
So you can imagine a is just a CPU/GPU combo, and b is your super mega CPU/GPU/WIFI/LTE/RAM/FLASH chip.