It's interesting to compare different predictions. Per Gurman, we'll see M3 something this year. On the other hand, there's a quote in this article (
https://www.anandtech.com/show/18970/tsmc-3nm-chips-for-smartphones-and-hpcs-coming-this-year):
"For those who are more cost sensitive, there is N3E, which can 'only' use up to 19 EUV layers and does not use EUV double patterning. Good news is that TSMC expects to commence mass production on this node to
Q4 2023."
Does that mean N3B is used for both A17 and M3? Weren't yields too low to do both? At least we're weeks away from the A17... Hoping those 3000+SC/7000+MC Geekbench scores are accurate.