M series iPhone Ultra speculation thread

[m1mini]

As per Mark Gurman's rumors, there is a possibility of an iPhone Ultra sku in 2024-2025. Do you think a lower bin version of M4 (or M5) like the 3p6e one they introduced could end up in iPhone Ultra?

My ideal iPhone Ultra specs would be

-M series CPU

-Same design as Pro/Max (larger than pro max)

-Same camera specs as the pro max

-+7.1" screen (a large body is needed for battery and thermals also)

-DeX like macOS/iPadOS support (or plain external monitor w stage manager support)

 

[senttoschool]

I can see the possibility. M4 works in the thinnest Apple product ever. It should work in an iPhone ultra as well.

 

[JPack]

M-series SoC packaging is far too big to fit on an iPhone logic board.

Whenever Apple launches their foldable is more realistic.

 

[Boil]

M4 Ultra in an iPhone, that's preposterous...! ;^p

 

[MayaUser]

we want M Extreme from the upcoming Mac Pro into the iphone super ultra

 

[MayaUser]

I can see the possibility. M4 works in the thinnest Apple product ever. It should work in an iPhone ultra as well.

yes but the logic board is not limited by the thickness but by the area

 

[m1mini]

M4 Ultra in an iPhone, that's preposterous...! ;^p

, m6 or m7 will be faster than m1-2 ultra, maybe they will put it to an iphone by then

 

[m1mini]

yes but the logic board is not limited by the thickness but by the area

what if they release a lower bin m4 specifically for the iphone? something with lower clock speed, 2 or 3p and 6e cores, and 8gpu cores.

 

[JPack]

what if they release a lower bin m4 specifically for the iphone? something with lower clock speed, 2 or 3p and 6e cores, and 8gpu cores.

Binning doesn’t help. There is no room for an M because those packages are about 50% wider and taller. Instead of RAM being underneath the SoC, the RAM is next to the SoC for better cooling and capacity.

You suggest something with fewer cores, lower frequency, and slower RAM. Guess what? That’s an A-series. 😄

 

[m1mini]

M1

Binning doesn’t help. There is no room for an M because those packages are about 50% wider and taller. Instead of RAM being underneath the SoC, the RAM is next to the SoC for better cooling and capacity.

You suggest something with fewer cores, lower frequency, and slower RAM. Guess what? That’s an A-series. 😄

M1 = 118 mm sq
A15= 107 mm sq

If they are not putting an m series cpu in an iphone then its still safe to assume a18 pro will feature more cores overall. if they could fit 6e cores in plain m4 it's certainly possible that they will do the same for a18 pro

 

[JPack]

M1

M1 = 118 mm sq
A15= 107 mm sq

If they are not putting an m series cpu in an iphone then its still safe to assume a18 pro will feature more cores overall. if they could fit 6e cores in plain m4 it's certainly possible that they will do the same for a18 pro

It’s not the die size that’s the problem. It’s the package.

Again, the DRAM is on the same plane as the SoC for M-series. You need far more pads for 128-bit memory interface. You need a heat spreader. This means the package is far bigger.

 

[m1mini]

It’s not the die size that’s the problem. It’s the package.

Again, the DRAM is on the same plane as the SoC for M-series. You need far more pads for 128-bit memory interface. You need a heat spreader. This means the package is far bigger.

Maybe they will engineer something else, given they could make the ipad 5 milimeters.

 

[Boil]

You need a heat spreader.

Best I can do is graphite sheet and a copper Apple logo...

 

[throAU]

Doubt it will happen, however they'll have a high end A series chip with more efficiency cores.

 

[thenewperson]

Ok Appletoni, let's be realistic now.