Regardless Digital trends is getting a bit too excited.Even by M3 a Max Quadro type chip in a laptop is unlikely. As efficient and small as N3 is, that’s asking a bit much. What is possible however is that the M3 Max itself will be 4 smaller interconnected dies.
N3 might let Apple collapse the "dual" into a single larger die. Then two of those would be "40 core worth". But yeah that still won't shrink something with a > 300W power budget down to something < 200W.
M1 has four targeted die configurations. Jade , Jade-chop , Jade2c , and Jade4c .
if M3 is down to three , then they may be looking at a different way to organize combos or collapse those last two into one.
the trade-off is that the chiplet/tile thing tends to consume more power than a monolithic. If first priority for Apple is chasing Perf/Watt they will mostly be looking for monolithic solutions where they can. And relatively expensive bleeding edge dense packaging where they had to go to tiles ( e.g., 2.5D-3D stacked on a custom interconnect tile with as smaller as possible microbumps. )
Good enough so that some vendors don't care anymore. I wouldn't be on Apple getting to point that they don't care. Folks in larger server product space don't care.
I suspect Intel cares too, but they are so far behind that is a deemed a secondary problem. They really don't have a choice to build at least some elsewhere due to capacity constraints.
