I am not saying this is fact. Apple may run three chip lines, base, pro and max. The binning may be done on those three lines. Or maybe Apple runs two lines, base/pro for one max for the other. I suspect they run just one chip line and the base, pro and max are separated during final testing.
Intel does this on their chips. All models come from the same die and have parts disabled that don't work bringing the chip down to a lower level. Intel will also lower the clock speed of chips that flounder under higher clock speeds thus giving lower performance.
It is incredibly expensive to make a silicone wafer, create the die, making the layers, etc. I cannot imagine a company running several die lines to create chips. It would be cheaper, and more effective, to have one die line and then separate the chips based on faults. So if a chip has 14 GPU cores, and two cores have flaws, the cores are disabled by laser and the chip sold as a 12 core GPU.
If the chip maker did not do this the yield for the die would be very low and the cost would be dramatically higher. Having a common die line saves money on production by using as many of the chips on the wafer as possible. I highly suspect that Apple does the exact same thing.