It's a bit of an art, but you actually can get better results via the 'grain of rice' method - if you look at your way, you can trap small bubbles of air, reducing the thermal conductivity between the die and heatsink. The grain of rice method removes that.
That said, looks like good results - of course, lapping the heatsink and ensuring no trapped air could lead to better results
Good to see that even the Apple genius' put too much heatsink compound in.![]()
I've only used AS-5 in ideal situations and never on a dual heatsink assembly, so maybe wait for some others to weigh in on what I'm about to say (I'm not sure and I might be wrong).
My first impression in looking at your photographs is that you might have trapped some air between the die and heatsink. Given the texture of AS-5 and the mount pressure here, it's hard for me to think otherwise.
You should see a few degrees of improvement over the next 200 hours as it cures, but I think it could be much better.
My advice would be to follow Arctic Silver's exact instructions for lidless mobile packages:
http://www.arcticsilver.com/pdf/appmeth/int/ss/intel_app_method_surface_spread_v1.1.pdf
I would do everything exactly as instructed, including tinting the heatsink. They suggest using a single-edge razor blade to spread onto the die and an old credit card to tint the heatsink.
Again, maybe first wait to see what others have to say. It has been a while since I've used this.
Thanks guys!
The way I actually spread the thermal paste was with my finger wrapped in plastic foil, like this:

I looked around online as to how others were doing it and came across this method:

This is taken from this thread:
http://www.overclockers.com/forums/showthread.php?t=496397
The instructions are:
Step 1 - Fold the straw to form a kink in it, resulting in a nice flat area about 1/4" wide,and begin to spread your AS5 with it.
Step 2 - Continue to spread the AS5 until it is very thin, like you usually would. You should still see tracks where you spread with the straw, which is normal.
Step 3 - Now, take the straw and lie it parallell to the CPU, and push down with just enough force to spread the AS5 more, and slide the straw up and down a few times to get rid of the straw "tracks".
I might try this out later, I'll give my laptop about 1-2 weeks to 'break in' and see what the temperatures are like then.
Judging by Swampus' comments about pockets of air and referencing my photos, I think its definitely possibly that that is what happened considering the very top of the thermal paste wasn't completely/perfectly flat, but rather had with very small points sticking upwards.
Now that I've taken apart the laptop once, doing this again will be fairly simple. To be honest, its not *that* difficult, but it is tedious. I took extra time with it, probably about 1.5-2 hours with a quick dinner break in between.