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Agreed... I keep thinking that we'll find a way to use electron spin and subatomic particles to further the law.

The thing that impressed me was the growing of transistors on layers other than the Silicon base layer. That lets the chips go where they never have gone before: vertical. In that way, the lines can be shorter (instead of having the RAM farm in a certain area, it can just be above the processing area).

Now, as an outsider, it's interesting to see what the engineers come up with, and I know they have the pressure to keep Moore's law.
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So, what is stuff made of?
~400 BC - Atomos - Democritus
~350 BC - Earth, Wind, and Fire Aristotle (a fan of disco). Oh yeah, Water left the band early to go solo.
1869 - Atoms of different weights - Mendeleev
1897 - Electrons and other stuff - Johnson
1911 - Electrons and Protons - Rutherford
1913 - Electrons are particles that orbit the nucleus of Protons - Bohr
1926 - Electrons move in a wave form - Schrodinger (and his cat... or not)
1931 - Electrons, Protons, and Neutrons - Chadwick/Rutherford
1964 - Crap... Protons, and Neutrons are made up of other stuff... What about electrons? NO! (well, maybe no) - Mann/Zweig
2017 - ???
Sources:
http://particleadventure.org/scale.html
http://cstl-csm.semo.edu/cwmcgowan/ch181/atomhist.htm
http://www.softschools.com/timelines/atomic_theory_timeline/95/

The point I'm making is that at each point, there is the question, "how far down can we go?" and there is always one (or more) discoveries that moves that wall. I'm just open to the possibility that there is something else, while keeping in mind the laws of Nature (including subatomic Nature) that are already discovered.

As a side note, when we try to predict how things will turn out, even on things that have no "choice" in the matter, we have to predict how each of those particles will behave. That, in the context of the Chaos Theory, makes everything just a good (or not) guess. All of the wisest people that I've talked to on the subject were the first to admit that what we know would fill a library. What we don't know fills the rest of the universe.
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Agreed. In the post above, I put why predicting nature is hard, and predicting individual humans and groups of them is even more difficult. Just look at the 2016 choices: Bad, and Worse. Who is who depends on your point of view...
It may be possible to go smaller, but to keep with the economics of Moore's law is just not realistic with current silicon production methods, Intel added another 14nm stepping for this reason. It's not hard to see we are hitting a limit here.
Again my argument is with current silicon based CPU production within 10 years it'll
1. be too expensive to shrink transistors further
2. even then eventually quantum tunneling is unavoidable

A different fab method which will cost untold billions in R&D and construction of new fab processes will be the end of Moore's law.
I have no doubt will find clever ways around this issue but it's not going to be cheap and it will radically shift the technology sector since everything has been possible because of Moore's law. What happens if CPU's suddenly cost double what they use to?
 
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It may be possible to go smaller, but to keep with the economics of Moore's law is just not realistic with current silicon production methods, Intel added another 14nm stepping for this reason. It's not hard to see we are hitting a limit here.
Again my argument is with current silicon based CPU production within 10 years it'll
1. be too expensive to shrink transistors further
2. even then eventually quantum tunneling is unavoidable

A different fab method which will cost untold billions in R&D and construction of new fab processes will be the end of Moore's law.
I have no doubt will find clever ways around this issue but it's not going to be cheap and it will radically shift the technology sector since everything has been possible because of Moore's law. What happens if CPU's suddenly cost double what they use to?
That makes sense.

Alternate technologies will have to be the future.
 
The current approach to improve capabilities as die shrinks become more and more challenging is through packaging.

Stacked die and multi-chip packages will continue to add significant capabilities at lower prices for the next few years anyway.
 
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