I'm pretty tech-savvy but I don't know the answer to this one. I have a Pismo upgraded to a G4/550 (I'm writing this post with it and TFF 31.5.0). I'm wanting to help it run cooler and such, and I have some AS5 to apply. Actually, I already did apply it once and it's helping, but I wonder if something about this upgrade card needs, well, help.
I don't know the name of it, but there's a plastic square around the CPU -- like a collar -- with screw holes where you can screw the heat sink in to keep good contact between CPU and heat sink. But here's the thing -- that plastic "collar" has separated from the CPU daughtercard, and it remains attached to the heat sink through its screws. My thinking is that this prevents the tight seal between heat sink and CPU that helps keep the CPU cooler. This plastic "collar" should be attached to the daughtercard, right? If so, would something like super glue be sufficient (and safe) to reattach it around the CPU to the card so that when I screw the heat sink back into it, a tighter bond forms and helps the heat dissipate away from the CPU?
I don't know the name of it, but there's a plastic square around the CPU -- like a collar -- with screw holes where you can screw the heat sink in to keep good contact between CPU and heat sink. But here's the thing -- that plastic "collar" has separated from the CPU daughtercard, and it remains attached to the heat sink through its screws. My thinking is that this prevents the tight seal between heat sink and CPU that helps keep the CPU cooler. This plastic "collar" should be attached to the daughtercard, right? If so, would something like super glue be sufficient (and safe) to reattach it around the CPU to the card so that when I screw the heat sink back into it, a tighter bond forms and helps the heat dissipate away from the CPU?