wait am i getting this right? You used thermal tape all over heatsinks, then just flipped the laptop and (presumably) thermal-taped a huge-ass heat sink on it?
Have any before/after benchmarks?
hm, technically i could use a smaller heat sink with active ventilation if i had a hole in the bottom and sticked it directly to the heat sinks.
(wonder how much loss you get by double-taping and having aluminium in between)
Do any "non-stick" thermal conductors exist? I dont want any glue residue on my heatsinks.
This could make the i9 scream...
No, I thermal coupled the heat pipe and the bottom panel with thermal pads. I can then just place a big heat sink on the bottom panel to cool it.
With the mod alone, no extra heat sinks, when placed upside-down I get 20 degrees cooler while running games, down from almost 100 to 77 degrees.
With the large heat sink and an external fan, the internal fans will stay at minimum speed with temps yet a few degrees lower at around 73.
It won’t make the i9 scream because peak turbo speeds are still limited by thermal paste performance. With this setup I have here I still hit 100 when running over 4Ghz even with a bock of ice cooling the bottom panel. This indicate a thermal bottleneck with the thermal compound. You would need to change that into liquid metal for a significant boost in peak performance.
Benchmark scores are not significantly changed, they just don’t drop at all over multiple cinebench runs. The first run is only like 20 points higher.
It would be possible to just stick this sink directly on the heat pipe. I’m guessing you’ll get minimal improvements because the thermal resistance of the back panel is minimal over such a large surface area. Applying liquid metal would make a much bigger difference when combined with my thermal mod.
Obviously you could go totally nuts, you can put a water block on the thermal system after applying liquid metal, but I don’t see the point because you can get a desktop computer with all 6 cores running at 5Ghz for half the cost.