Seriously, try to read articles that aren't only quoted on an Apple site. TSMC went for being first with older tech and an inferior process over a superior process. This isn't opinion, it's a fact in the industry.
You say, "
Some people just don't read... Sigh"
My sentiments exactly. Try to venture beyond the Apple bubble to get your news in the industry.
https://www.zdnet.com/article/samsung-unveils-7nm-technology-with-euv/
Or you try to read site from reporting on Actual Tech, and not reporting PR site like Zdnet? Try Anandtech, Realworldtech, for a start.
And if you really want, you can read up on invest notes from ASML, ask them many EUV equipment they have shipped to Samsung that is anywhere near the production capacity requirement for TSMC and Apple.
And btw, to your original comment, in case you don't know, Samsung's Fab is actually cheaper than TSMC.
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That's just speculation. Samsung firmly confirmed that their 7nm EUV is on track and they aren't facing any delays. Also EUV should improve yields and make 5nm possible. Nobody said anything about Apple here, the discussion is about TSMC and Samsung Semiconductor.
Also the advantages of 7nm EUV vs TSMC's 7nm are not theoretical.
It kind of depends, Samsung could be happy with a 50% yield ( Their NAND and DRAM business are doing extremely well which could definitely absorb any loses ), while GF and TSMC won't be so happy. Than there is a definition of on track and HVM. What is HVM? How many unit and wafer shipped can be labeled as HVM? For Apple it is rather simple, at least 20M per month, the sales of latest iPhone in monthly average. And we will only know when it ships.
Samsung definitely has the advantage here, 7nm vs TSMC 7nm. There isn't an augment about it. And there shouldn't be. But that is also like Intel 10nm, which is better than Samsung 7nm and TSMC 5nm, is it capable of HVM?
People will need to start understanding the technical merit and manufacturing capacity and capability. Currently it is not only just yield issues, ASML, the only manufacture of EUV equipments are only shipping a few equipment per month. You could paid them billions and they still cant make them any faster. One reason why EUV is available in Samsung and GF first before TSMC, its in a scale of its own.
To put it simply, on technical merit, Intel 10nm > Samsung 7nm > TSMC 7nm. On real world tech shipping in millions + unit, TSMC > everyone else. ( You don't need to wait for Apple to confirm that, the Huawei Kirin 980 is on TSMC 7nm, scheduled for release in a few days time )