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Maybe Apple's huge foreign currency backlog is preventing much wanted "true innovation"?
If the President and Congress were able to get tax laws re-written and recoup some of the multi-billions of foreign earnings currently "in limbo" overseas, maybe then we could get a new KabyLake Mac Mini Pro, an i7 MacBook Pro with 64 Gb DDR4 & standard function keys, a modular & upgradable MacPro that takes standard PC GPU cards, etc., etc.
Engineering a full set of Mac Pro models would cost much, much less than the landscaping on the doughnut campus.

It's not a tax code issue.
 
http://semiaccurate.com/forums/showpost.php?p=291393&postcount=32

Fottmeberg said:
Another interesting thing, is that Hexus and Bit-Tech have broke Intel NDA. Usually the Chinese (Es. ChinaDIY) magazines publish review before the NDA deadline.

Why? Because Intel don't really give CPUs and Mobos as gifts anymore. No more free expensive toys. No more expensive ADS from Intel, also.

These sites have to stay alive thanks to Google ads revenue et similia (Did you notice the invasion of ads in these sites? Even Anandatech!).

So, fu3k NDA!

Intel NDA, of course, not NVIDIA or AMD NDAs. Why not AMD NDA? Because AMD is now giving a lot of free hardware (At B&C we received a Ryzen 7 1700X, Asus Crosshair VI Hero and the AIO of Asetek as gift). AMD is now a good partner for these sites. So, in the near future, you will see a lot of ************ thrown to Intel.

As usually, however, we will write - at B&C - objective review. We don't care about the gifts of Intel, AMD or NVIDIA (For this reason NVIDIA don't send us anything for a long time).

:) Well, thats how it works in this industry ;).
 
Apple cannot be bothered to update the Mac Mini, so I don't see them putting serious resources into creating a Mac Mini Pro - especially one that would require liquid cooling for the CPU and GPU.

As for multiple tower options, Apple has not done that since the Quadra days. Each Power Mac and Mac Pro has always been a single case design during their active sales life and I expect that to continue.
I suppose Mini is dead as is, but there could be, who knows Apple TV Pro on the roadmap, that is actually VR capable Apple TV + Mac Mini together. And that could run on AMD & Apple co-designed custom chip. Seamless change between the OS's and sharing resources through hUMA and APFS.
 
I suppose Mini is dead as is, but there could be, who knows Apple TV Pro on the roadmap, that is actually VR capable Apple TV + Mac Mini together. And that could run on AMD & Apple co-designed custom chip. Seamless change between the OS's and sharing resources through hUMA and APFS.

I really don't expect Apple to position the Apple TV as a console against Playstation VR. We're far more likely to see it driven off an iPhone ala the Samsung Gear VR.
 
Reviews are up, and they confirm initial reviews about power consumption and thermals of the CPUs.

If you ant to buy either 7820X, or 7900X you better get liquid cooling, because it is no-go on Air.

7820X 10-15% faster than 1800X, while consuming 75W more, costing more for CPU alone, and going into more expensive HEDT platform. If anyone wants high core counts and Intel branding - go Intel 7900X. Lower SKUs are just not worth it, the additional cost.

One of best reviews out there(ignore the typical Fanboy calling out on the internet over TomsHardware. Their Review suite is most important. They are possibly the only one who test the CPUs in scientific and engineering applications.):
http://www.tomshardware.com/reviews/intel-core-i9-7900x-skylake-x,5092-9.html

If anyone asks. iMac Pro will require some magic in cooling solution to effectively cool those CPUs. Soldering of the IHS on Xeon CPUs(rumored, so far, but still possible) will help, but to genuinely little degree. I have to say this: putting those CPUs in Mac Pro 7.1 in trash can design would result in absolute thermal disaster.
 
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Reviews are up, and they confirm initial reviews about power consumption and thermals of the CPUs.

If you ant to buy either 7820X, or 7900X you better get liquid cooling, because it is no-go on Air.

7820X 10-15% faster than 1800X, while consuming 75W more, costing more for CPU alone, and going into more expensive HEDT platform. If anyone wants high core counts and Intel branding - go Intel 7900X. Lower SKUs are just not worth it, the additional cost.

One of best reviews out there(ignore the typical Fanboy calling out on the internet over TomsHardware. Their Review suite is most important. They are possibly the only one who test the CPUs in scientific and engineering applications.):
http://www.tomshardware.com/reviews/intel-core-i9-7900x-skylake-x,5092-9.html

If anyone asks. iMac Pro will require some magic in cooling solution to effectively cool those CPUs. Soldering of the IHS on Xeon CPUs(rumored, so far, but still possible) will help, but to genuinely little degree. I have to say this: putting those CPUs in Mac Pro 7.1 in trash can design would result in absolute thermal disaster.

Yeah, the basic structure is set, huge changes to power usage are not coming just because its name will change to Xeon. They might down clock it a little to keep things sane, but it can't be much from a PR perspective. The iMac Pro is going to need throttling or resource management in some way. The 10 core is consuming 230 W in the torture loop, I shudder to think about what a non-nerfed 18-core would draw. Throw in a under load GPU too.... yow.... Its too bad they don't have the 7800/7820 in there for those so we could see how that scales. Anyway, Apple seems to have engineered itself into another corner with the iMac Pro. Designed properly there is no reason the 'modular' Mac Pro couldn't handle these types of power usages, but I'm lost all trust in Apple to design anything properly.
 
According to folks at WDCC who saw the iMac Pro, the two fans inside at max RPM move a tremendous volume of air out the back so worries about the machine doing a "Three Mile Island" under load might just be hyperbole.
 
According to folks at WDCC who saw the iMac Pro, the two fans inside at max RPM move a tremendous volume of air out the back so worries about the machine doing a "Three Mile Island" under load might just be hyperbole.

And what did that sound like?

And the review was on liquid...
 
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Do you work at Intel?
Do I have to work at Intel to know that design is shared between lanes of products at Intel?

There are three types of dies Intel manufactures for HEDT/Server CPUs.

LLC - up to 12 cores.
MCC - up to 20 cores.
HCC - up to 32 cores.

There is ONE design that is shared between HEDT and Server CPUs. Intel can make custom decision to cut down some features from those CPUs to make them fit in particular price segment, and force people to pay more if they want more, hence the difference in PCIe lanes of 7820X and 7900X.

The only thing that MAY differ both dies in end products is that IHS in Xeon CPUs will be soldered, for better thermals, but that remains to be confirmed.
 
Do I have to work at Intel to know that design is shared between lanes of products at Intel?

Thanks.

You should totally submit your designs to Intel and Apple since they don't know what they're doing.

If only they read Macrumors then they'd get educated.
 
Thanks.

You should totally submit your designs to Intel and Apple since they don't know what they're doing.

If only they read Macrumors then they'd get educated.
I have no idea why you feel offended by what I am writing.

Core designs, and their naming are well known, at this point. You can search the names for yourself.

P.S. Which CPU dies Intel Xeon e5 v4 Used? The same as HEDT Broadwell-E 6XXX lineup.
The only difference between the dies is microcode and naming.
 
I have no idea why you feel offended by what I am writing.

Core designs, and their naming are well known, at this point. You can search the names for yourself.

P.S. Which CPU dies Intel Xeon e5 v4 Used? The same as HEDT Broadwell-E 6XXX lineup.
The only difference between the dies is microcode and naming.


Oh I'm not offended. I just don't want anyone who doesn't know any better to take speculative posts as fact.
 
Oh I'm not offended. I just don't want anyone who doesn't know any better to take speculative posts as fact.
This is not speculative post.

If you do not believe me, send an email to any Intel rep with a question, what type of die the Xeon CPUs will use. LCC, MCC, HCC? And in what core count segments.

Then come back and report what they have told you.
 
I have to say this: putting those CPUs in Mac Pro 7.1 in trash can design would result in absolute thermal disaster.

Good thing the Mac Pro 7,1 won't be a trashcan design ;)

And those CPUs won't be going into the new Mac Pro either, it'll be Xeons.
 
Good thing the Mac Pro 7,1 won't be a trashcan design ;)

And those CPUs won't be going into the new Mac Pro either, it'll be Xeons.
The same dies are going to be used in Xeon's. There is one design for HEDT, and Server CPUs.
You're muddying the speculation by posting facts.... ;)
You are going to argue with that in previous years Intel used the same dies for HEDT and Server chips? For example 6900X was different die, and different CPU from Xeon E5-1680v4?

What socket both CPUs used?
 
Even if the i9s and v5 Xeons share a similar architecture, that does not mean they're going to run equally as hot. The Xeons will likely run at a lower base clock since they will not be optimized for single-core like the i9s. You can get 10-core Broadwell v4 Xeons that run at half the TDP of the 10-core Broadwell-E desktop CPUs.
 
Aren't the Vega GPUS set to go into the iMac Pro 300-375W? I don't understand how that adds up.

honestly wouldn't surprise me if the machine they demod at WWDC didn't even have those chips in it.
 
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