I can't speak for the solder, but if we add up all the issues from solder, to inadequately sized air ducts etc I think it's fair to say that the 6,1 is not a successful design. Conceptually it may have been a sound idea and should have worked on paper, but in practice it's not working out as planned.
Only thing fair to said here is your don't like the tcMP.
FACTS: the Airflow inside the Thermal Core is bigger than the airflow you can have from std cpu/gpu coolers (case fans dont account since only drive air inside-outside the TC is more like an open-rig).
tcMP issues affects a limited number of users, some users on extreme climate or environment plus heavy loads (as a friend from Portugal which used to do heavy renders all weekend on 40 deg Celsius or about 100deg F, c'mon there even a mac mini playing videos melts).
Mine works 10h-14h every day, even I use to carry it to my home (not easy task on a cMP), even some time I run a heavy process for a week using full CPU (no GPU, but also I use to run few cpu heavy apps specially when I run some theoretical experiments), an nowadays its is the most reliable Mac I've ever own, previously I ve kernel panics, issues with PCIe slots, a spinner HDD failure and lots of jammed DVDs, that's history I love absolutely the tcMP is über powerful and insanely compact even portable.
But i concede you something, Apple should uprate the tcMP TDP to allow more thermal flexibility and less throttling, from 450W to 600W is perfectly possible w/o complications, just a new speedy fan and new fin arrangements inside the thermal core, even a heat-pipe based thermal core could handle 1200W easy w/o size increase (something i demonstrated on another thread).
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In my opinion, the much-hyped "thermal core" design is inadequate for the power it must dissipate. Not that this is necessarily the problem, but when was the last time you saw a premium fan/heat-sink assembly that did not have heat pipes and a heck of a lot more fin surface area? And the "thermal core" has to support the CPU plus two GPUs, not just one chip.
here are two engineers with large experience on thermodynamics, one of them it's me, I can say you're wrong, the TC its efficient and effective, the problem is on the fan which is de-rated and the PSU overloaded, other issues as cracking solders and thermal paste aren't TC issues the same problem would have been surfaced on a classic design.
PD Thermal pipes aren't used on Clusters, just simple aluminum fins, and those behemoths run full 24x7xMonths solving a single challenge. Look at SuperMicro and HPE's Moonshoot, only exception is when they decide to use liquid cooling on some rigs to provide heating to some near buildings but this is unusual since increases the cost and taxes reliability.