Why no 3.33 12-Core?

[VirtualRain]

Hottest of my 8 cores at idle and under load is core no.1 (per Real Temp), coming in at scorching 37 degrees centigrade when idle, but when rendering a QT movie in Cinebench 11.5 it rises to an hellacious 63 degrees centigrade. Could it be the temps? And as for noise, maybe I forgot to reinstall my fans because I didn't hear the fans at idle or at render time. Could it be the noise? Over one year A.S.*, my 3.2 Ghz 8-core still runs cool and quietly even when rendering in Motion, Maya, and Cinema 4d 11.5 and while achieving a geekbench score of 19,474. Does a very powerful weightlifter have to strain (i.e., sweat) or cry out when doing heavy lifting that a weaker soul could achieve? I submit the answer is "no." If my temps are too hot, then maybe our favorite company needs to get out of my kitchen.


A.S. means After the Swap.

As I suspected, it's not a concern for you. 🙂 Perhaps it wasn't a concern for Apple either, but I think that's why you're not seeing 130W CPUs in the two socket boards. However, others have raised other possible explanations such as stratospheric price points (not traditionally an issue for our favorite company), or power constraints (less likely to be the issue in my opinion with the limited peripherals that need power for such a large seemingly over spec'd PSU).

 

[Tutor]

clean-up

Clean up

 

[iRobertM]

Someone just posted a picture of the 3.33 heat-sink. It takes up almost the whole bottom board so I am guessing you can't order the x2 3.33 because they could not adequately cool them.

 

[deconstruct60]

Someone just posted a picture of the 3.33 heat-sink. It takes up almost the whole bottom board so I am guessing you can't order the x2 3.33 because they could not adequately cool them.

That heatsink is probably being conservative. They want to be in the bounds of whatever gets done on the CPU ( or plugged in elsewhere in the box). If you center the heat sink as a target for the circular fan blowing at it then the fan 's air flow can be more efficient. Apple doesn't want the heat from the CPU to go out into the box. They want the heat to be blown out the case hole that is directly behind the CPU in the air flow.

So distributing the heat radiation along that large diameter air flow vector allows it to pick most of it up and chuck it out the box without resulting to creating mini turbo jet levels of airflow. The more efficient the transfer of heat to the moving air the less volume you need to push through the box.