I’m gonna say no, with the caveat that it makes sense for Apple and TSMC to get off N3B as soon as possible as it’s a dead end with Apple being pretty much the only volume purchaser of it 🤷♂️
It likely isn't 'volume' as much as it is long term buyer.
Some reports are that Intel's Arrow Lake and Lunar Lake ( Ultra 200 variants. at least some of Lunar Lake and some large fraction of Arrow Lake ) compute tiles will be using N3B. ). Is Intel going to buy as many wafers as Apple did? Probably not. Is it 'low volume'? Again probably not.
With the extended delay, it might have made sense for Intel to switch to N3E, but I suspect it was too late in the process. Also doing re-spin to Intel 20A was costly enough, that they just kept going with N3B as the alternative version.
Core Ultra 5 240F, expected to use two versions of the Arrow Lake-S silicon A new rumor suggests Intel will continue its ‘tradition’ to mix silicon dies within the mid-range CPU segment. The next-gen Arrow Lake-S series is on track to debut on the desktop platform this year, introducing the...
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[ I suspect that the 'mobile' versions of Arrow lake will be the TSMC 8+16 die also. I wouldn't be surprised if there are 'extra' of those before the 'mobile' versions ramp that those are the alt 8+16 for the i5. With Intel doing a major time shift of N3B wafers, it wouldn't be surprising if TSMC was making them consume wafers whether they wanted them or not; penalty for early cancellation.
Not going to be surprised if the only 'eat your own dog food' , 20A die is the 6+8 one that would incrementally cheaper to re-spin. ]
Lunar Lake appears to have same basic core design as Arrow Lake ( Lion Cove / Skymont) so likely the same design for N3B just in a different sized and chunked die.
HP Spectre X360 laptop with Intel Core Ultra 200V “Lunar Lake” shows up in first benchmarks One of the first tests of Xe2 graphics: even faster graphics at less power. HP is set to introduce a refresh of its laptop featuring a foldable screen, dubbed the X360 Spectre. This upcoming 2-in-1...
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Intel has made some "18A Lunar Lake" statements, but I suspect those won't be the highest volume part, nor truly arriving in 2024. [ An 18A Lunar Lake 'refresh' in 2025 wouldn't be too surprising. Or something bigger than just 4+4 cores. ]
Pretty good chance Intel is going to save a major chunk of its limited EUV fab capacity to make higher margin Xeon 6 products and outsource smaller die size at higher volume to TSMC ( who have lots more EUV fab capacity than Intel. )
However, by the end of 2025, if Intel has alternates on their own process and the volume is substantively lower ( because Ultra 300 (Panther Lake) and Xeon 7 are ramping up. ) Intel will likely scale back once they have bought whatever large volume of wafer starts they signed up to buy years ago. ( Unless Arrow/Lunar Lake turn out to be break away hits. I wouldn't hold my breath on that one. They have lots of good competition. And some new quirks like no SMT which will chase off a few folks. )
The core 'problem' is that Intel will be scaling down at least as fast as Apple will on N3B in 2025-26. ( the chip in the current iPhone 15 isn't going to change and Apple will still be selling a substantive volume of those two years from now. )