Yes, we kind of do. LPDDR5 are made mostly by Samsung, Micron, or SK-Hynix. With the M3 Max using four LPDDR5, if you want 256GB of RAM then each LPDDR has to be 64GB. None of the manufacturers ever announced they could do that, and only recently did Samsung claim they could make 32GB LPDDR5x, though they don't have it on their sales page. The M4 Max will use four of those to get 128GB.
As for TB5, while it is true there is a separate IC for the interface, to handle the power delivery requirement, the handshakes, etc., the M3 SoC still has to have IO controllers that are designed to handle the bandwidth, and the display controllers on the SoC have to deal with multiple 8K displays.
As for interconnect between the two sides of the Ultra SoC: a noticeable fraction of the surface area of a die for a large SoC is for wiring all the pieces together, and notably the memory controllers. One does not merely paste two such die together. The engineers will have to had laid out the wiring ahead of time knowing that an interconnect is going to be implemented.
Not sure what you’re arguing.. seems you start with its not possible for a max to have 256 gb ram… so how does the ultra have 512? Agreed two max’s are not glued together, never said it was, the interconnect is old news. But still where does the ultra get its extra memory from? As for tb5, the extra secret sauce is in fact off the chip. The fact that part of the controller is on the chip doesn’t say it never was before. People want to say it’s not the original max being used in the ultra when Apple says it is.
But as Spock says, if you rule out the possible, then no matter how improbable, the impossible is likely. The ultra is two maxes connected the same way they always have been. No mystery.