[doublepost=1482298757][/doublepost]Personally, I would defer to IEEE with regard to discussions on electrical engineering related matters like voiding, and here is a very comprehensive article on the matter:
http://ewh.ieee.org/soc/cpmt/presentations/cpmt1509b.pdf
Take note of the info at the bottom of page 18 which says:
Note that "shear strength" has to do with the possibility a solder join will break, crack or separate from the PCB over time. Does voiding have anything to do with shear strength? Yes, it absolutely does.