Basically, Apple is re-inventing PCs. This could be the start of user swappable RAM, SSD and potentially discrete GPUs.
Imagine a Macbook with the base GPU and the option for Apple discrete GPU
For ex [M5 Pro 18-core GPU w/M5 Max 40-core discrete GPU]
Utterly missing the point.
The point here is the claim that PoP will not be used. It's unclear if this is even news.
Standard PoP consists of a design like below. The memory (one or two stacks, one, two or four chips high) is wirebonded to a carrier, and the SoC is mounted under the carrier.
If you want to modify this, there are multiple options to do so.
We know that up to the A15 things were done like the above. With A16 things get murky. The only discussion of A16 I've ever found is
https://eetimes.itmedia.co.jp/ee/articles/2210/25/news048_2.html
which gives this picture
This COULD be a version of standard wirebonded PoP. Or it could be something different, with VIAs going through the glass epoxy?
The article is unclear and seems to be most excited about the capacitors mounted between the SoC and the SoC carrier.
Maybe a native Japanese speaker can get something more out of it than the machine translation?
I've seen nothing whatsoever about the packaging of either A17 or A18. Die shots yes, but not the packaging.
Point is, here's nothing here about swappable DRAM. That's as dead as swappable transistors.
The issues are
(a) will the packaged be vertical ("3D") rather than side-by-side ("2.5D"). Probably IMHO.
(b) will the DRAM be packaged using something that's NOT wirebonding. eg the vertical vias used by HBM. That costs a little more, but uses a little less power than wirebonding.
(c) will PiM be present? Apple has a bunch of patents on how to use PiM, and it's the obvious next step in DRAM evolution, so the only question really is will it be 2026? Or earlier?? Or later :-(