I am not a a big semiconductor nerd, so I am speculating. But putting all the chips in a single package, like the S10 on the Apple Watch is where I think Apple is goingNot sure that is the vision. Apple is using the word 'subsystem' in the actual article. The Cx and the Ayy in the same multi-die package perhaps. But trying to put it all on one die? Probably not.
P.S. At some point Qualcomm probably won't either as keep progressing below N3 . I/O connections are not scaling (shrinking) well.