of course RAM in the same package as the SoC has numerous technical advantages. First, you can GREATLY reduce the power of the drivers (on both the RAM and the SoC) because they have far less capacitance to drive. (Capacitance is proportional to the distance between the CPU and the RAM. Though that undersells it, because motherboard traces are also much wider (and taller) than the in-package traces, which means it’s really a much bigger improvement.
Additionally, latency is greatly reduced. It takes signals around 6ps per mm to travel within the package. Slightly slower on the PCB (depending on dielectric materials, etc.). But that’s a lot more millimeters to travel.
That also means that the penalty of a cache miss is much higher. So to keep performance reasonable, if memory is not inside the package, apple would probably have had to increase the size of the L2 cache by quite a bit. Which would, of course, take more die area, burn more power, etc.
In fact, distance between the RAM and CPU is so important that I wrote a section in my PhD dissertation on a scheme to stack the RAM together with the CPU in order to minimize that distance.