Foundry customers is exactly what Intel needs, and they f***d that opportunity up to a high degree already with pulling out of 18A.
Intel didn't pull out of 18A. The high volume customers didn't show up. Intel dropped 20A to put more resources into 18A.
" .. Surprising news about Intel continues to emerge with the chipmaker vowing to use an external foundry in place of its own 20A process to make the upcoming Arrow Lake processors, amid talk that Broadcom has rejected Intel's 18A process as not ready for mass production. ..."
Meanwhile, Broadcom reportedly displeased with 18A wafers
www.theregister.com
Arrow lake was suppose to be partially split on TSMC N3B and and 20A and they dropped 20A. In retrospect, that problem should have happened quicker ( might have had less disappointed customers for 18A if had got the design kits and the bugs worked out sooner).
What happened with 18A is that most folks dropped out. So it doesn't make sense to spend tons more marketing and external sales, external tool development tracking 18A improvements and following variants , if no one wants to buy it in volume. Intel is still doing 18A for themselves. If I recall correctly there are some relatively low volume customers still signed up, but they aren't 'chasing' anyone new at this point.
Whether or not 14A will yield remains to be seen, but if they don't get a big customer on it, it's over.
Likely not over , just slower. There would be an 18A refinement with another label slapped on it rather than '14'. 18AP. 18AE or something like that. Same thing as TSMC has a N3P after N3E and N3B.
The huge problem for Intel is that they can't particular sell the older stuff either ( mainly had their own internal design tool ecosystem for previous generations ). There is a substantive design infrastructure have to have outside of just the core fab process technology itself to make it reasonable for customers to use the tach.
There is no one size fits all node and a single tool that will work for a very diverse set of customers. Intel has been super slow on the update of that. Intel made noises about trying to find more fab customers back in 2013-2015 time frame and never did the real grunt work required.
Apple won't bet on the success of 14A, that wold be a stupid move, and they will not use Intel as a 2nd source to TSMC either, take way too much money in those nodes to double design, test, plus, no 2 processes are compatible so. there will always be performance differences ... like we've seen 10 or so years ago when Apple dual sourced that A chip from both TSMC and Samsung ...
Apple doesn't have to solely use 14A. The next Hn. Wn , chips are going to be. TSMC N2 or A16? Probably not.
Apple's silicon portfolio is more than just the bleeding edge phone chip now.
Different fab processes are going to excellent in different areas. The more different chips Apple has to build then the more different areas/opportunities there are.
Intel doesn't just make wafers then also do chip-on-chip packaging (foveros. That isn't solely Intel die only territory).
All that current pour of money does for Intel is making the cashflow look good over the next couple years, the real problem is they need to be acting as a true foundry, on par with TSMC. Laying off all the engineers didn't help.
Intel itself needs to use its own foundries again, if they continue to outsource to TSMC - what does that tell you?
Intel 'need' to use. 20A for Arrow Lake ( which if recall correctly started out as N3 only) was part of the problem. The core problem here isn't using or not using it is weaving in at the rate points and at the right rate or evolution.
Boundary can't go from having. 1-3 customers ( PC-server, Altera , modem ) to having 15-20 in one iteration on a single fab process design.
Long term fab companies have customers spead out over multiple fab generations. Most of TSMC revenue doesnt come solely from the most bleeding edge process. Have to grow the business.
Intel had tons of overhead/infrastructure built up on interal only coupling between fab and design. The engineers assigned to that aren't necessarily who they need to get to a position where Intel design interacts not pariicularly differently than any other customer. Not going to get customers if all can expect is secondary crumbs that fall off the table after fab primarily just serves one customer. There is substantive about of trust that goes into signed up also. Intel had/has problem where design would ask fab to bail them out of certain things and vice versa.
Intel other issue was that they were trying to be a make everthing for everybody company. They had their hand in just about everything. When stop doing that some engineers are going to get dropped. '