Steak said:Don't worry, I never put up more than $50 in a single evening, so even when I'm cold, it won't dent my winnings!!!
I would call them Double Dual G5sw1tcher said:They could call it the Quadra.![]()
kawa_on_mac said:I would call them Double Dual G5![]()
Sun Baked said:Good god man, how many pins do you think that would take? An insanely large amount with each one of those FSBs not sharing a darn thing.
The sheer number of pins on a dual mean they cannot stick with a single chip design. Heck the entire thing is complex enough that it needs a cheap and simple CPU just to do a power on reset (aka service processor.)
Of course the Memory Controller is an extremely hot chip and needs to keep moving to better fab techniques as the clock speed increase -- not too far away from needing active cooling right now.
The HT-Tunnels can be sourced from somebody else, and the I/O chip doesn't need to be updated very often.
Lacero said:Intel and AMD have both introduced dual-core designs. Apple is likely to follow suit with the next PM updates. I'm certain of it or I'll serve up my severed nuts.
FFTT said:The number or processors that Apple can fit into a desktop workstation
is directly related to how many blades they can fit in a Gillette razor.![]()
I didn't read the entire thread, but I wouldn't be so sure. The whole chip industry has HIT THE WALL where clock speeds are concerned. Unless some breakthrough comes along, don't expect anything that dramatic from anyone (referring to 5 GHz). BTW, the liquid cooling in the 2.5 GHz PowerMac is there primarily to keep the noise levels down - it could run without the liquid cooling in place, but it would be significantly louder.Lacero said:They can pretty top out as fast as IBM can make enough quantities. Since the PMs use water cooling, pretty much assured of over +5GHz speeds possible with not increase in fan noise if IBM is capable of reaching such speeds in the next 3 years.
Apple can eek out at least another 5 years from their PM form factor.
Loud, like the dual 2 GHz Opteron 1U server I just brought up a few days ago. It's damn near deafening. Compared to my 2x2.5GHz PM (both machines are Folding 24x7), the Opteron server sounds like a jet engine.wrldwzrd89 said:I didn't read the entire thread, but I wouldn't be so sure. The whole chip industry has HIT THE WALL where clock speeds are concerned. Unless some breakthrough comes along, don't expect anything that dramatic from anyone (referring to 5 GHz). BTW, the liquid cooling in the 2.5 GHz PowerMac is there primarily to keep the noise levels down - it could run without the liquid cooling in place, but it would be significantly louder.
ddtlm said:melgross:
Since they'd been at 2.5ghz for 10 months (or maybe 8 if you include shipping delays) I'd hope IBM can intro a dual core at the same speed.
Based on what evidence do you make this claim, and why do you even bother making it? Obviously they needed liquid cooling to make a reasonable desktop machine (at launch time), otherwise they wouldn't have done it.BTW, the liquid cooling in the 2.5 GHz PowerMac is there primarily to keep the noise levels down - it could run without the liquid cooling in place, but it would be significantly louder.
Lacero said:They can pretty top out as fast as IBM can make enough quantities. Since the PMs use water cooling, pretty much assured of over +5GHz speeds possible with not increase in fan noise if IBM is capable of reaching such speeds in the next 3 years.
Apple can eek out at least another 5 years from their PM form factor.
ddtlm said:melgross:
Well, I'm not trying to enourage anyone to expect dual-dual 3.0.I'm just thinking that IBM is bound to ahve learned a thing or two in the last 8+ months, and can probably produce 970fx's a little faster than 2.5ghz by now. Also, ding ding ding, more important point: the extra thermal load from the second core may not scare off IBM/Apple like it does AMD/Intel. As long as the thermal denisty is all right, Apple can engineer as big a heatsink as they darn well please. Apple is not bound to any particular specification for cases or motherboards, and so there is no reason to stop at 95W for the complete package as AMD does. I think it is perfectly reasonable to expect them to launch a dual dual at 2.5ghz or higher.
ddtlm:ddtlm said:wrldwzrd89:
Based on what evidence do you make this claim, and why do you even bother making it? Obviously they needed liquid cooling to make a reasonable desktop machine (at launch time), otherwise they wouldn't have done it.
wrldwzrd89 said:I didn't read the entire thread, but I wouldn't be so sure. The whole chip industry has HIT THE WALL where clock speeds are concerned. Unless some breakthrough comes along, don't expect anything that dramatic from anyone (referring to 5 GHz). BTW, the liquid cooling in the 2.5 GHz PowerMac is there primarily to keep the noise levels down - it could run without the liquid cooling in place, but it would be significantly louder.
melgross said:You're kidding, right. This is a fun post?
The 970x series is going to top out at about 3.0GHz. I hope we get there. Maybe .2GHz less or more.
Remember that these cooling problems are not just about the total amount of watts. The 2.5GHz chips dissipate less excess wattage, not more. It's the fact that the wattage is coming from an ever decreasing area. If you use half the wattage, but the area that is utilizing it is one quarter the size, then the temp produced is going to be higher. Less overall "heat", but concentrated over a smaller area, the temp rises.
The problem with this is that the temp diffuses through the chip and case at the same thermal speed as it did before. That causes a temp rise to be more serious that it was before. It becomes more difficult to cool because there is less area for the cooling system to interface with. The thermal resistence of the overall chip/cooling system is higher, slowing heat transfer from the INSIDE of the chip to the cooling interface.
While liquid cooling systems have a lower thermal resistence than do air cooled systems (because liquid has a greater thermal mass, as molecules in a liquid are closer together, eg. more of them per cubic cm), the problem remains as to how to get the "heat" out of the chip itself.
There are schemes as to how to do that, but so far they are only in the experimental stages. They present drastically different solutions to these problems, compared with even the cooling systems being used by Apple today, though ultimately some of them do use liquid cooling.
After all of this, if you have actually read it all, we can see that While Apple's cooling solution is good for todays chips, it may not be sufficient for those of 2 or 3 years from now.