After the chips are bonded and packaged, final testing is done to determine both proper function and rated speed. Different chips in the same batch will often run at different speeds. Special test fixtures run each chip at different pressures, temperatures, and speeds, looking for the point at which the chip stops working. At this point, the maximum successful speed is noted and the final chips are sorted into bins with those that tested at a similar speed. For example, the Pentium III 750, 866, and 1000 are all exactly the same chip made using the same die. They were sorted at the end of the manufacturing cycle by speed.