True. The octo would be good for ~3300$ segment as W3680 will likely settle for ~3700$. However, IF there will be a Xeon version (W3660?) of the rumored i7-970 (six core @3.2GHz) for $800ish, that would solve the octo issue as it provides the exact same 19.2GHz (again, using my inaccurate calcs 😛) and would likely go for ~3400$ in Mac Pro. I should have included this in my ealier posts already but I forgot, as usual 😀
I'd be utterly shocked if they suddenly swap out for Enthusiast Desktop parts (i7 LGA1366, no matter the core count). The cost is the same between those and the SP Xeons, so any shortcomings in part range exists in both lines (ECC is the distinguishing feature). It would also mean that Apple would then have to carry non-ECC memory as well, reducing their buying power (quantity purchases), potentially increasing their parts costs and adding complexity to the assembly process (now they have to make sure the correct memory is installed).
As per a W3660, I've not seen or heard anything, and expect we'd have by now (W3690 @ 3.43GHz is scheduled, but even later).
They need 3 : base , better, best with it topping out at 3.3.
Exactly. To keep 3 models in the SP systems, they either have to wait on the W3620 and W3640, or use existing W35xx parts in the lower systems (i.e. W3530 @ 2.8GHz, and W3550 @ 3.06GHz) for the base and mid-level systems. The W35xx parts will allow the existing MSRP's to remain without a loss in margin.
We'll have to wait and see, but I'm not sure how much more buyers would be willing to take in terms of price increases, even if they're getting more system.
Your forgetting that the new chip parts have to catch the product design cycle. Next years product development are already in motion now. If the parts don't come and look extremely stable yesterday, they aren't going to make the cut.
To me, this was implied.
😱 If a part's not ready (have to carry on with an existing part, as vapor doesn't cut it
😛), or deemed unsuitable, it's skipped. Even if it means carrying on a product with older parts (i.e. C2D and a discrete GPU used in laptops by Apple).
Same thing happened for USB 3.0. They parts were out about year before showed up in any real volume. Don't see how light peak is going to be any different. It too isn't going to be purely a hardware addition that you plug in and it magically works just with solely new hardware.
The earlier USB 3.0 chips had issues, such as high power consumption. There's still bandwidth issues with the PCIe lane configuration IIRC (not enough lanes to reach full band), but I expect will be corrected in the next generation.
As per LP, there's definitely a software side to the equation, not to mention any bridge devices that might be needed (depending on what the user wants to connect via LP).