What you are seeing are the consequences of using small heatsinks, small fans, conservative fan curves and an aluminum body. Aluminium tends to want to hold onto heat (or any temp for that matter) a little longer than plastic.
It could also be a problem of OSX not disabling the dGPU after you closed diablo. This would cause the temps to be higher because Apple made the design decision to have both CPU and dGPU on the same heatsink. This causes a heatsink to not be used in the way they were designed. The thermal paste Apple uses also is applied in an ample amount causing heat to be trapped in the pockets that form when the heatsink is pressed onto the chip. This can cause heat build up that can't be carried away by the heatsink. As shown below.. All manufactures are guilty of this...
Heat should be carried away from one end of the heat pipe to the other. When there are 2 different heat sources being carried away to different sections of the pipe it can cause the entire pipe to constantly be transferring heat to the cooling running chip and not to the fan. Heat will also want to get trapped in the location shown below..
This is an 11 inch laptop with a 45 watt quad core and a GT 650m. This is one way you can use 1 fan and combine heatinks the correct way. One side is the "hot" side and the other is the "cool" side. This means 1 fan can cool both without throttling and won't heat up the other chip if it's not in use.
This shows how a heat pipe works. Imagine two different heat sources trying to be cooled.. it isn't ideal IMO They probably did this ( in conjunction with not giving the mac a big enough power supply) because they didn't foresee a user putting a max load on both GPU and CPU in a gaming scenario. In their defense, they don't market a Mac as a gaming machine and it's not built to be one at all.
I don't claim to be an expert but after studying heat sinks and modding heatsinks in laptops and desktops this design is frowned upon. There are also other issues with Apple's design such as the thickness and length of the pipe which can also lead to heat issues. I rate a heat sinks' ability to cool a component based on how long the "cool down" time is. That is; the time is takes to drop a temp from a fully loaded chip back down to idle temps after letting the computer get up to idle temp. For example.. My G46VW has a fully loaded CPU temp of 83c, once the load has disappeared, it takes 23 seconds for the temp to drop to 38-40c which is my idle temp. My Macbook takes over 2 minutes and the fan is still screaming after 30 seconds from when the full load has disappeared. This is not an official test but it's my way of testing.
If I am wrong please state your facts because I love to learn.. one other thing, there is a reason Apple advertises CPU speed of their notebooks with the non turbo clock speed more often than the turbo boost speed.