bbrosemer said:Damn those inch thick design flaws, too bad dell doesnt put out anything other then their plastic bohemith perfect designs.
what the heck. the mods lock one thread so you move on to here.
A desing flaw is a design flaw. And this design flaw had a simple solution in correct application of the thermo paste. Report after report of people here on this board is conferming that.
As for moving the heat better it is possible to "pipe it" around so it the heat engery is spread out of a larger area of the surface of the laptop which means the highest tempture at any one point is lower. Total heat engergy is the same but the tempture at any one point is reduced. Also the draw back to metal is it will quickly heats up to unbarible temps for human skin (60C or 140F is kind of hot)
The simple fact is apple screwed up bit time on this one. And it sits in the thermo paste they are calling for which is to much.
You are starting to target my post when one thread gets locked. Also please note that "pipe-it" is in quotation marks as just a term to help think of how heat can be moved. right now it is very localized and they just need to spread out the head some. Or find a better way of sheading it.