Naw, it's all about number of screws, number of pieces, and number of solder pads. Shape doesn't matter much. In fact this tube shape is actually easier to work with - from what I know about FA (factory automation).
Apple pays to ship the parts to their assembly plants, then to a warehouse after completed, then to stores or airports, if the later then also to warehouses and/or stores when they land. You only have to pay for the very last leg of distribution (from it's stored location to your front door).
No, no. Again it's all about the number of pieces, number of screws, number of cables needing to be attached, and so on. Look again.
- Where are the wiring harnesses? Vastly reduced!
- Where's the drive backplane? Gone.
- Sleds? Gone,
- 6 SATA headers, 4 SATA power headers? All gone,
- GPU cards, No longer hand fitted. Also probably manufactured internally and without the need for the power connectors, cables, heat-sinks, or fans.
- ODD drive doors? Gone!
- ODD cage? Gone,
- Rear expansion slot covers and screw? All gone,
- CPU heat-sinks, GPU heat-sinks, Chipset heat-sinks? All morphed into one and set up so that a robot can do it FA style.
- The 3 different port-out PWBs? Became one - even the AC power looks surfaced onto that same singular PWB,
- The card edge headers? Gone. this reduces a lot of expense in just this single exclusion.
- Third party fans? Only one is needed now. There are four on my MP and all are purchased from a 3rd party supplier.
No, totally bro. They have streamlined both cost and production on this new system - maxed it out. As I said elsewhere the new MacPro is an engineering feat and a half! and almost all of that engineering was for Apple's own benefit == lower costs all around!
Yup, a lot of intelligence has been applied to this machine. Now the only thing is to wait and see if it ultimately pays off for them.
Yeah, that's a question I have as well. If they don't intend to offer a dual CPU configuration then why use Xeon? It's useful in this design for something I'm spacing off or?