sorry, didn't mean to start another tangent
But the current P4 and Xeon chips also have the same defensive capability.
I only mentioned this thermal protection in the context of the story about IBM's reluctance to run the PPC970 at 2.0 GHz in the JS20.
The IBM engineers probably felt that there were common failure modes (dead chassis fans, blocked airflow, high room temperature) that could not be survived with the chip clocked at 2.0 GHz.
I once visited a Compaq test lab where they had some prototype PIII Xeon workstations undergoing thermal testing. They literally had the motherboard and power supply in an "oven" where it was being "baked" while running exercisers.
Something caught my eye - the SCSI cable snaked out of the oven to a disk on the workbench. I asked about that - the response was:
"We know the disk will burn up at those temperatures - but we're not testing the disk."
I have no doubt but that IBM has baked the JS20 as well....
thatwendigo said:It's a bit misleading...
But the current P4 and Xeon chips also have the same defensive capability.
I only mentioned this thermal protection in the context of the story about IBM's reluctance to run the PPC970 at 2.0 GHz in the JS20.
The IBM engineers probably felt that there were common failure modes (dead chassis fans, blocked airflow, high room temperature) that could not be survived with the chip clocked at 2.0 GHz.
I once visited a Compaq test lab where they had some prototype PIII Xeon workstations undergoing thermal testing. They literally had the motherboard and power supply in an "oven" where it was being "baked" while running exercisers.
Something caught my eye - the SCSI cable snaked out of the oven to a disk on the workbench. I asked about that - the response was:
"We know the disk will burn up at those temperatures - but we're not testing the disk."
I have no doubt but that IBM has baked the JS20 as well....