As a pre-new-years preparation for smashing out productivity in 2018, I decided to pull the 4 big aluminum towers out of my office and give them all a thorough clean up (plus vacuum the carpet in the dusty space they took up).
The dust inside the Macs wasn't as bad as I expected, except the Mac Pro, which had a bit of a build up on the intake fans, but does get much more run time than the PowerPCs.
As part of the process, I wanted to re-do the thermal paste on the G5s which is a job I have never done before and they all still had their factory set, cracked and powdered white silicon gunk.
So, here is the photo journal of the job; (I stopped taking photos after doing the first two machines).

1. All disconnected and setup under the back patio, ready for a clean up. Notice my home-made long Hex tool for getting the CPUs out in the early gen G5s. 1x straightened out allen key tightly zip tied onto another larger/longer one for getting down into the gap on the CPU card/heatsink. Rough, but it works.

2. The first G5 (Dual 1.8Ghz) is stripped and the PSU is removed, all the components are lined up for cleaning with an old toothbrush.

3. Inside the first PSU after blowing all the dust out. There is a little rust on the case around the fans, but nothing critical.

4. Cleaning all the components.

5. The Geforce FX 5200 lined up with the fans, HDD and SuperDrive.

6. Separating the CPU from the heatsink requires removing six small philips head screws on the plastic standoffs, then four torx mounting screws which fix the CPU against the heatsink's coldplate.

7. The aluminum coldplate on the underside of the monster heatsink with the old factory thermal paste.

8. The G5 CPU die or IHS (Integrated Heat Spreader) with the cracked and powdered thermal paste.

9. A beauty shot of the first 970 CPU after a cleanup. Notice the massive array of components around the CPU, this is matched on the other side of the PCB. I wonder if these make up the G5's "215 simultaneous in-flight instructions per CPU". A rough first count was 196, maybe I missed some.

10. A very thin layer of "Duratech" 6.5W/m-K (Silver 30%) heatsink compound. This is a very malleable paste which smooshes and spreads evenly, despite it looking like a rough surface in the (flash) photo.
Repeated again for the second CPU and the first G5 is back together again, ready to run through ASD for testing everything.
(Post to be continued with more photos below...)
The dust inside the Macs wasn't as bad as I expected, except the Mac Pro, which had a bit of a build up on the intake fans, but does get much more run time than the PowerPCs.
As part of the process, I wanted to re-do the thermal paste on the G5s which is a job I have never done before and they all still had their factory set, cracked and powdered white silicon gunk.
So, here is the photo journal of the job; (I stopped taking photos after doing the first two machines).

1. All disconnected and setup under the back patio, ready for a clean up. Notice my home-made long Hex tool for getting the CPUs out in the early gen G5s. 1x straightened out allen key tightly zip tied onto another larger/longer one for getting down into the gap on the CPU card/heatsink. Rough, but it works.

2. The first G5 (Dual 1.8Ghz) is stripped and the PSU is removed, all the components are lined up for cleaning with an old toothbrush.

3. Inside the first PSU after blowing all the dust out. There is a little rust on the case around the fans, but nothing critical.

4. Cleaning all the components.

5. The Geforce FX 5200 lined up with the fans, HDD and SuperDrive.

6. Separating the CPU from the heatsink requires removing six small philips head screws on the plastic standoffs, then four torx mounting screws which fix the CPU against the heatsink's coldplate.

7. The aluminum coldplate on the underside of the monster heatsink with the old factory thermal paste.

8. The G5 CPU die or IHS (Integrated Heat Spreader) with the cracked and powdered thermal paste.

9. A beauty shot of the first 970 CPU after a cleanup. Notice the massive array of components around the CPU, this is matched on the other side of the PCB. I wonder if these make up the G5's "215 simultaneous in-flight instructions per CPU". A rough first count was 196, maybe I missed some.

10. A very thin layer of "Duratech" 6.5W/m-K (Silver 30%) heatsink compound. This is a very malleable paste which smooshes and spreads evenly, despite it looking like a rough surface in the (flash) photo.
Repeated again for the second CPU and the first G5 is back together again, ready to run through ASD for testing everything.
(Post to be continued with more photos below...)