- Apr 12, 2001
DigiTimes today offers a series of reports involving Apple, revealing a number of claims from industry sources in Taiwan regarding the next-generation iPhone, Apple's possible plans for USB 3.0, and iPad component suppliers.
One report claims that Taiwanese firm Pegatron Technology, a two-year old company created as part of a restructuring of ASUS, has landed a contract with Apple to manufacture the next-generation iPhone. Pegatron reportedly will join existing iPhone manufacturer Foxconn in production of the new models due for introduction later this year.
Another report notes that Genesys Logic has denied that recent sampling quantities of USB 3.0 device controllers are destined for Apple, refuting claims from industry sources that Apple is company behind the design request. USB 3.0, which finally began to make an industry splash with numerous product introductions at CES earlier this year, theoretically offers a 10x improvement in transfer speed over USB 2.0 as well as increased power capabilities for powering attached devices.
The same report offers a look at major component winners for Apple's iPad, with Broadcom reportedly supplying Wi-Fi, Bluetooth, and touchscreen controller chips, while Infineon is handling the RF and baseband chips. Novatek (LCD driver), Linear (battery power management) and NXP (system power management) are also named as suppliers for the iPad. A separate report claims that Radiant Opto-Electronics will have provided 300,000 LED backlights to Apple for the iPad during the month of January. And finally, Yageo, Cyntec and Mag.Layers Scientific-Technics, manufacturers of passive components such as resistors and diodes, are all also reportedly providing components to Apple for the iPad.
Article Link: Taiwanese Industry Sources: Next-Generation iPhone Manufacturing Deal, USB 3.0, iPad Suppliers