I'm a bit confused by that part…
The Wikipedia list for Xeons says -W processors support up to 8xDIMMs, but the corresponding entry for individual processors says 4x memory channels, as do the ark.intel pages:
https://ark.intel.com/products/125038
And these are 1S setups, so I have no idea where the 8 DIMM stuff comes from. Using just the 4 channels for 2 DIMMs a piece?
A memory channel is a single bus that DIMMs are connected to. If look at the current iMac 27" processors page will see two channels (since the mainstream processor design) so those machines max out at 64GB. The number of DIMM sockets sitting on a channel is typically called rank ( so can have 1 , 2 , or sometimes 3 or 4 ) all sitting on one controller.
You can kind of indirectly see it on the summary ark summary pages in the ratio between absolute maximum RAM supported and number of memory channels. If DIMMS top out at 32GB ( or previous years 16GB) you to have to have more to get to the very high multiple.
So for example the i5-7500 in a mid range iMac 27".
https://ark.intel.com/products/97123/Intel-Core-i5-7500-Processor-6M-Cache-up-to-3_80-GHz .
Two channels and maxes out at 64GB ( using 16GB DIMMs ).
whereas the W 2145
https://ark.intel.com/products/126707/Intel-Xeon--W-2145-Processor-11M-Cache-3_70-GHz
Four channels and maxes out at 512GB. ( that is either a limit rank of 3 for 32GB or limited to 2 but there is a mapping for some 64GB DIMMs in there which don't really exist yet. Probably is 8 DIMMs as outlined. )
A Xeon Gold 6144 (similar 8 core as the 2145)
https://ark.intel.com/products/124943/Intel-Xeon-Gold-6144-Processor-24_75M-Cache-3_50-GHz
Four channels and maxes out at 768GB ( 4 x 3 x 64GB = 768GB ) .
The Mac mini getting turned into a taller box versus getting shrunk into a NUC is interesting. It's another area where the Mac mini is so many things to so many people that any deviation from its current form is going to dismay some users.
Conceptually, it is orienting the box ( literally turning it ) more so that pushing it out of the NUC category. It still would be about NUC sized in volume ( a bit bigger, but certainly would run cooler). It is just whether the long side is down touching the desk or sitting up in the air. If trying to keep it very cool and quiet (with active cooling) tilting it up and put as large a fan as can get away with (but still smaller than footprint) fan on top probably works better.
To get to the larger fan the Mini sits on top of it. And then the flow is turned 90 degrees to go out. If instead you just flow with the natural flow then not at odds with super sharp turns. You should be able to crank the RPMs down a notch since not swimming in "wrong" direction.
If made it more like rounded corner rectangle folks could still place it long edge down (for like rack/shelf placement ) and cooling would go "old bottom " to "old top" (but essentially be front-to-back). Widening the base ( height in "old" orientation) menas there is even less pressure to get rid of the 2.5" SATA drive. ( Apple is a bit conflicted they want everyone on Flash storage but also charge much higher than average for Flash storage. High $/GB pushes folks on a tighter budgets to HDD with have much better $/GB stats. If they want folks off so bad bing the Flash $/GB price down. ).
That would be waaaaay better than simply just trying to make the mini an even flatter pancake ( slavishly following the every thinner Mac laptop trend line. ). Following the laptops for internal is one thing. Taking on all of their physical trends is misguided. 0.02lbs lighter sitting on a desktop is not making a difference. neither is 1.1-1.2 versus 1.4 inches tall.
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Just give me a Mac Pro with custom Intel chips in a big.LITTLE configuration, 4-6 cores at 4.5ghz and 10+ cores at 2.5-3ghz
Pragmatically already do that with the desktop processor design. Only it is the iGPU that is the "max core count at much lower GHz".
Intel could conceptually do that as they move the high core count processors to EMIB , but it wouldn't be one die.
https://www.anandtech.com/show/1174...-stratix-10-fpga-live-blog-845am-pt-345pm-utc
And I wouldn't hold my breadth. I doubt that would work even with separate dies in the same package at the power levels 50-60+ W power levels talking about here. The heat from the 4.5GHz stuff is going to leak over and vice versa it all bundled in the same package.
Big.Little makes sense in devices that spend at least half the day in sleep (or non interactive ) mode. That isn't the Intel W class mainstream workload.